Neal E. Ulen

Person

Yelm, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Contact protection for integrated circuit device loading
- Patent number 9,681,556
- Issue date Jun 13, 2017
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit connectors
- Patent number 9,265,170
- Issue date Feb 16, 2016
- Intel Corporation
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Unified retention mechanism for CPU/socket loading and thermal solu...
- Patent number 7,988,459
- Issue date Aug 2, 2011
- Intel Corporation
- Neal Ulen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink mounting and interface mechanism and method of assembling...
- Patent number 7,042,727
- Issue date May 9, 2006
- Intel Corporation
- Neal E. Ulen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit heat sink support and retention mechanism
- Patent number 6,563,213
- Issue date May 13, 2003
- Intel Corporation
- Thomas Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit heat sink support and retention mechanism
- Patent number 6,529,378
- Issue date Mar 4, 2003
- Intel Corporation
- Thomas Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microprocessor heat sink retention module
- Patent number 6,483,704
- Issue date Nov 19, 2002
- Intel Corporation
- Neal Ulen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processor EMI shielding
- Patent number 6,243,265
- Issue date Jun 5, 2001
- Intel Corporation
- Thomas Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink retention components and system
- Patent number 6,205,026
- Issue date Mar 20, 2001
- Intel Corporation
- Thomas J. Wong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT CONNECTORS
- Publication number 20150118870
- Publication date Apr 30, 2015
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PROTECTION FOR INTEGRATED CIRCUIT DEVICE LOADING
- Publication number 20140092573
- Publication date Apr 3, 2014
- David J. LLAPITAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Unified retention mechanism for CPU/socket Loading and thermal solu...
- Publication number 20100330824
- Publication date Dec 30, 2010
- Neal Ulen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated heat sink assembly
- Publication number 20050117305
- Publication date Jun 2, 2005
- Neal E. Ulen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink mounting and interface mechanism and method of assembling...
- Publication number 20050068740
- Publication date Mar 31, 2005
- Neal E. Ulen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROPROCESSOR HEAT SINK RETENTION MODULE
- Publication number 20020141158
- Publication date Oct 3, 2002
- Neal Ulen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit heat sink support and retention mechanism
- Publication number 20010002729
- Publication date Jun 7, 2001
- Intel Corporation
- Thomas Wong
- H01 - BASIC ELECTRIC ELEMENTS

Neal E. Ulen

Person

Patents Grantslast 30 patents

Contact protection for integrated circuit device loading

Integrated circuit connectors

Unified retention mechanism for CPU/socket loading and thermal solu...

Heat sink mounting and interface mechanism and method of assembling...

Integrated circuit heat sink support and retention mechanism

Integrated circuit heat sink support and retention mechanism

Microprocessor heat sink retention module

Processor EMI shielding

Heat sink retention components and system

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT CONNECTORS

CONTACT PROTECTION FOR INTEGRATED CIRCUIT DEVICE LOADING

Unified retention mechanism for CPU/socket Loading and thermal solu...

Integrated heat sink assembly

Heat sink mounting and interface mechanism and method of assembling...

MICROPROCESSOR HEAT SINK RETENTION MODULE

Integrated circuit heat sink support and retention mechanism