Nee Seng Ling

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Patents Grantslast 30 patents

Information Patent Grant
Ball mounting apparatus and method
- Patent number 8,061,583
- Issue date Nov 22, 2011
- Rokko Ventures Pte Ltd
- Nee Seng Ling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and machine for underfilling an assembly to form a semicondu...
- Patent number 6,225,144
- Issue date May 1, 2001
- Motorola, Inc.
- James Boon Hua How
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Ball Mounting Apparatus and Method
- Publication number 20120031954
- Publication date Feb 9, 2012
- ROKKO VENTURES PTE LTD
- Nee Seng Ling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLAMPING ASSEMBLY
- Publication number 20100096735
- Publication date Apr 22, 2010
- ROKKO TECHNOLOGY PTE LTD.
- Xue F. Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL MOUNTING APPARATUS AND METHOD
- Publication number 20100051671
- Publication date Mar 4, 2010
- Nee Seng Ling
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR