Neeraj Kumar Reddy DANTU

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Houston, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Configurable substrate and systems
- Patent number 11,171,126
- Issue date Nov 9, 2021
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for routing bond wires in system in a package (SiP) devices
- Patent number 11,157,676
- Issue date Oct 26, 2021
- OCTAVO SYSTEMS LLC
- Neeraj Kumar Reddy Dantu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR ROUTING BOND WIRES IN SYSTEM IN A PACKAGE (SIP) DEVICES
- Publication number 20190347378
- Publication date Nov 14, 2019
- Octavo Systems LLC
- Neeraj Kumar Reddy DANTU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMPROVED SYSTEM USING SYSTEM IN PACKAGE COMPONENTS
- Publication number 20190074268
- Publication date Mar 7, 2019
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS