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Neha M. Patel
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Rounded metal trace corner for stress reduction
Patent number
11,784,150
Issue date
Oct 10, 2023
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rounded metal trace corner for stress reduction
Patent number
11,380,643
Issue date
Jul 5, 2022
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rounded metal trace corner for stress reduction
Patent number
10,797,014
Issue date
Oct 6, 2020
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sintered solder for fine pitch first-level interconnect (FLI) appli...
Patent number
10,515,914
Issue date
Dec 24, 2019
Intel Corporation
Mihir A. Oka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sintered solder for fine pitch first-level interconnect (FLI) appli...
Patent number
10,224,299
Issue date
Mar 5, 2019
Intel Corporation
Mihir A. Oka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated microelectronic package temperature sensor
Patent number
9,028,142
Issue date
May 12, 2015
Intel Corporation
Nachiket R. Raravikar
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Stress sensor for in-situ measurement of package-induced stress in...
Patent number
8,586,393
Issue date
Nov 19, 2013
Intel Corporation
Mohammad M. Farahani
G01 - MEASURING TESTING
Information
Patent Grant
Stress sensor for in-situ measurement of package-induced stress in...
Patent number
8,174,084
Issue date
May 8, 2012
Intel Corporation
Mohammad M. Farahani
G01 - MEASURING TESTING
Information
Patent Grant
Carbon nanotube-based stress sensor
Patent number
7,553,681
Issue date
Jun 30, 2009
Intel Corporation
Nachiket R. Raravikar
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
ROUNDED METAL TRACE CORNER FOR STRESS REDUCTION
Publication number
20220285306
Publication date
Sep 8, 2022
Intel Corporation
Dae-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ROUNDED METAL TRACE CORNER FOR STRESS REDUCTION
Publication number
20200402940
Publication date
Dec 24, 2020
Intel Corporation
Dae-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ROUNDED METAL TRACE CORNER FOR STRESS REDUCTION
Publication number
20190157232
Publication date
May 23, 2019
Intel Corporation
Dae-Wood Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLI...
Publication number
20190157225
Publication date
May 23, 2019
Intel Corporation
Mihir A. OKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLI...
Publication number
20180190604
Publication date
Jul 5, 2018
Intel Corporation
Mihir A. OKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEFLECTION SENSOR FOR IN-SITU DEFLECTION MEASUREMENT IN SEMICONDUCT...
Publication number
20140013855
Publication date
Jan 16, 2014
Mohammad M. FARAHANI
G01 - MEASURING TESTING
Information
Patent Application
Integrated Microelectronic Package Temperature Sensor
Publication number
20120199830
Publication date
Aug 9, 2012
Nachiket R. Raravikar
G01 - MEASURING TESTING
Information
Patent Application
STRESS SENSOR FOR IN-SITU MEASUREMENT OF PACKAGE-INDUCED STRESS IN...
Publication number
20120193734
Publication date
Aug 2, 2012
Intel Corporation
Mohammad M. Farahani
G01 - MEASURING TESTING
Information
Patent Application
Microelectronic die having nano-particle containing passivation lay...
Publication number
20080237822
Publication date
Oct 2, 2008
Nachiket R. Raravikar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stress sensor for in-situ measurement of package-induced stress in...
Publication number
20080067619
Publication date
Mar 20, 2008
Mohammad M. Farahani
G01 - MEASURING TESTING
Information
Patent Application
Integrated microelectronic package temperature sensor
Publication number
20080002755
Publication date
Jan 3, 2008
Nachiket R. Raravikar
G01 - MEASURING TESTING
Information
Patent Application
Integrated microelectronic package stress sensor
Publication number
20070298525
Publication date
Dec 27, 2007
Nachiket R. Raravikar
G01 - MEASURING TESTING
Information
Patent Application
Carbon nanotube-based stress sensor
Publication number
20070222472
Publication date
Sep 27, 2007
Nachiket R. Raravikar
G01 - MEASURING TESTING
Information
Patent Application
Sensing moisture uptake of package polymers
Publication number
20070107500
Publication date
May 17, 2007
Neha Patel
G01 - MEASURING TESTING