Neng-hsing Lu

Person

Endwell, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Plasma processing apparatus including three bus structures
- Patent number 5,061,359
- Issue date Oct 29, 1991
- International Business Machines Corporation
- Suryadevara V. Babu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Side source center sink plasma reactor
- Patent number 5,021,138
- Issue date Jun 4, 1991
- Suryadevara V. Babu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma conditioning of a substrate for electroless plating
- Patent number 4,956,197
- Issue date Sep 11, 1990
- International Business Machines Corporation
- Suryadevara V. Babu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabrication of CPI layers
- Patent number 4,820,376
- Issue date Apr 11, 1989
- American Telephone and Telegraph Company AT&T Bell Laboratories
- William R. Lambert
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for the production of void-free prepreg sheets
- Patent number 4,690,836
- Issue date Sep 1, 1987
- International Business Machines Corp.
- Thomas C. Clarke
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Uniform plasma for drill smear removal reactor
- Patent number 4,618,477
- Issue date Oct 21, 1986
- International Business Machines Corporation
- Suryadevara V. Babu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reactor for plasma desmear of high aspect ratio hole
- Patent number 4,601,807
- Issue date Jul 22, 1986
- International Business Machines Corporation
- John C. Lo
- H01 - BASIC ELECTRIC ELEMENTS

Neng-hsing Lu

Person

Patents Grantslast 30 patents

Plasma processing apparatus including three bus structures

Side source center sink plasma reactor

Plasma conditioning of a substrate for electroless plating

Fabrication of CPI layers

Process for the production of void-free prepreg sheets

Uniform plasma for drill smear removal reactor

Reactor for plasma desmear of high aspect ratio hole