Neng Liu

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Montreal, CA

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Patents Grantslast 30 patents

Information Patent Grant
Chip-carrier socket for microfluidic-cooled three-dimensional elect...
- Patent number 11,562,942
- Issue date Jan 24, 2023
- Telefonaktiebolaget LM Ericsson (publ)
- Neng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency three-dimensional electronic-photonic integrated ci...
- Patent number 11,456,523
- Issue date Sep 27, 2022
- Telefonaktiebolaget LM Ericsson (publ)
- Neng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS/NEMS integrated broken racetrack tunable laser diode
- Patent number 11,239,635
- Issue date Feb 1, 2022
- Telefonaktiebolaget LM Ericsson (publ)
- Neng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfluidic cooled 3D electronic-photonic integrated circuit
- Patent number 11,171,075
- Issue date Nov 9, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Neng Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMS/NEMS Integrated Broken Racetrack Tunable Laser Diode
- Publication number 20210239906
- Publication date Aug 5, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Neng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-Carrier Socket for Microfluidic-Cooled Three-Dimensional Elect...
- Publication number 20210166991
- Publication date Jun 3, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Neng LIU
- G02 - OPTICS
Information Patent Application
Radio-Frequency Three-Dimensional Electronic-Photonic Integrated Ci...
- Publication number 20210028534
- Publication date Jan 28, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Neng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Microfluidic Cooled 3D Electronic-Photonic Integrated Circuit
- Publication number 20200013699
- Publication date Jan 9, 2020
- Telefonaktiebolaget LM Ericsson (publ)
- Neng Liu
- H01 - BASIC ELECTRIC ELEMENTS