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Patents Grants
last 30 patents
Information
Patent Grant
Apparatus and method for packaging circuits
Patent number
8,138,617
Issue date
Mar 20, 2012
Round Rock Research, LLC
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level packaging
Patent number
8,106,488
Issue date
Jan 31, 2012
Micron Technology, Inc.
Swee Kwang Chua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Castellation wafer level packaging of integrated circuit chips
Patent number
8,008,126
Issue date
Aug 30, 2011
Micron Technology, Inc.
Boon Suan Jeung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Castellation wafer level packaging of integrated circuit chips
Patent number
7,679,179
Issue date
Mar 16, 2010
Micron Technology, Inc.
Boon Suan Jeung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for packaging circuits
Patent number
7,675,169
Issue date
Mar 9, 2010
Micron Technology, Inc.
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Castellation wafer level packaging of integrated circuit chips
Patent number
7,528,477
Issue date
May 5, 2009
Micron Technology, Inc.
Boon Suan Jeung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating packaged die
Patent number
7,358,154
Issue date
Apr 15, 2008
Micron Technology, Inc.
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Support elements for semiconductor devices with peripherally locate...
Patent number
7,285,850
Issue date
Oct 23, 2007
Micron Technology, Inc.
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Castellation wafer level packaging of integrated circuit chips
Patent number
7,276,387
Issue date
Oct 2, 2007
Micron Technology, Inc.
Boon Suan Jeung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and semiconductor device components with peri...
Patent number
7,226,809
Issue date
Jun 5, 2007
Micron Technology, Inc.
Chia Yong Poo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor devices including peripherally located bond pads, int...
Patent number
7,115,984
Issue date
Oct 3, 2006
Micron Technology, Inc.
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Castellation wafer level packaging of integrated circuit chips
Patent number
6,949,407
Issue date
Sep 27, 2005
Micron Technology, Inc.
Boon Suan Jeung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for packaging circuits
Patent number
6,894,386
Issue date
May 17, 2005
Micron Technology, Inc.
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Castellation wafer level packaging of integrated circuit chips
Patent number
6,855,572
Issue date
Feb 15, 2005
Micron Technology, Inc.
Boon Suan Jeung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and semiconductor device components with peri...
Patent number
6,818,977
Issue date
Nov 16, 2004
Micron Technology, Inc.
Chia Yong Poo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor devices including peripherally located bond pads, ass...
Patent number
6,727,116
Issue date
Apr 27, 2004
Micron Technology, Inc.
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level stackable semiconductor package
Patent number
6,611,052
Issue date
Aug 26, 2003
Micron Technology, Inc.
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable semiconductor package and wafer level fabrication method
Patent number
6,582,992
Issue date
Jun 24, 2003
Micron Technology, Inc.
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
WAFER LEVEL PACKAGING
Publication number
20110018143
Publication date
Jan 27, 2011
Swee Kwang Chua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS
Publication number
20100068851
Publication date
Mar 18, 2010
Micron Technology, Inc.
Boon Suan Jeung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC IMAGERS AND METHODS FOR MANUFACTURING SUCH MICROELE...
Publication number
20090014822
Publication date
Jan 15, 2009
Micron Technology, Inc.
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS
Publication number
20080067675
Publication date
Mar 20, 2008
Micron Technology, Inc.
Boon Suan Jeung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor devices including peripherally located bond pads, int...
Publication number
20060208351
Publication date
Sep 21, 2006
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Support elements for semiconductor devices with peripherally locate...
Publication number
20060208350
Publication date
Sep 21, 2006
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus and method for packaging circuits
Publication number
20060084240
Publication date
Apr 20, 2006
Micron Technology, Inc.
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Castellation wafer level packaging of integrated circuit chips
Publication number
20060014319
Publication date
Jan 19, 2006
Micron Technology, Inc.
Boon Suan Jeung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Castellation wafer level packaging of integrated circuit chips
Publication number
20060008946
Publication date
Jan 12, 2006
Micron Technology, Inc.
Boon Suan Jeung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Castellation wafer level packaging of integrated circuit chips
Publication number
20060006519
Publication date
Jan 12, 2006
Micron Technology, Inc.
Boon Suan Jeung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Castellation wafer level packaging of integrated circuit chips
Publication number
20060001142
Publication date
Jan 5, 2006
Micron Technology, Inc.
Boon Suan Jeung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS
Publication number
20050130345
Publication date
Jun 16, 2005
Micron Technology, Inc.
Boon Suan Jeung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus and method for packaging circuits
Publication number
20050029668
Publication date
Feb 10, 2005
Micron Technology, Inc.
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor devices including peripherally located bond pads, int...
Publication number
20040124523
Publication date
Jul 1, 2004
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Castellation wafer level packaging of integrated circuit chips
Publication number
20040043535
Publication date
Mar 4, 2004
Boon Suan Jeung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor devices and semiconductor device components with peri...
Publication number
20030230802
Publication date
Dec 18, 2003
Chia Yong Poo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICES INCLUDING PERIPHERALLY LOCATED BOND PADS, ASS...
Publication number
20030232460
Publication date
Dec 18, 2003
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor devices and semiconductor device components with peri...
Publication number
20030232462
Publication date
Dec 18, 2003
Chia Yong Poo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Stackable semiconductor package and wafer level fabrication method
Publication number
20030094683
Publication date
May 22, 2003
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKABLE SEMICONDUCTOR PACKAGE AND WAFER LEVEL FABRICATION METHOD
Publication number
20030096454
Publication date
May 22, 2003
Chia Yong Poo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus and method for packaging circuits
Publication number
20030067001
Publication date
Apr 10, 2003
Micron Technology, Inc.
Chin Yong Poo
H01 - BASIC ELECTRIC ELEMENTS