Ng Hong Wan

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Build-up-package for integrated circuit devices, and methods of mak...
- Patent number 7,691,682
- Issue date Apr 6, 2010
- Micron Technology, Inc.
- Ng Hong Wan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...
- Publication number 20110266701
- Publication date Nov 3, 2011
- Micron Technology, Inc.
- Ng Hong Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL BUILD-UP-PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...
- Publication number 20090001551
- Publication date Jan 1, 2009
- Ng Hong Wan
- H01 - BASIC ELECTRIC ELEMENTS