Ngai Kin Tsui

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Hong Kong, CN

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Patents Grantslast 30 patents

Information Patent Grant
Coating for enhancing adhesion of molding compound to semiconductor...
- Patent number 7,329,617
- Issue date Feb 12, 2008
- ASM Assembly Automation LTD
- Jianxiong Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Coating for enhancing adhesion of molding compound to semiconductor...
- Publication number 20060131720
- Publication date Jun 22, 2006
- Jianxiong Li
- H01 - BASIC ELECTRIC ELEMENTS