TREA

Nguk Chin Lai

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  • Penang, MY
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Patents Grantslast 30 patents

  • Information Patent Grant

    Die offset die to die bonding
    • Patent number 7,750,481
    • Issue date Jul 6, 2010
    • Spansion LLC
    • Nguk Chin Lai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die offset die to bonding
    • Patent number 7,674,653
    • Issue date Mar 9, 2010
    • Spansion LLC
    • Nguk Chin Lai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die offset die to die bonding
    • Patent number 7,554,204
    • Issue date Jun 30, 2009
    • Spansion LLC
    • Nguk Chin Lai
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents