Nhat D. Vo

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stress relief of a semiconductor device
- Patent number 7,960,814
- Issue date Jun 14, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Nhat Dinh Vo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having pads and input/output (I/O) cells
- Patent number 7,808,117
- Issue date Oct 5, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Nhat D. Vo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderable metal finish for integrated circuit package leads and me...
- Patent number 7,215,014
- Issue date May 8, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Peng Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor with coated leads and method therefore
- Patent number 7,105,383
- Issue date Sep 12, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Nhat D. Vo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged integrated circuit and method therefor
- Patent number 6,617,524
- Issue date Sep 9, 2003
- Motorola, Inc.
- Nhat D. Vo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TIN-BASED WIREBOND STRUCTURES
- Publication number 20140367859
- Publication date Dec 18, 2014
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced Electronic Component Packages with Through Mold...
- Publication number 20140063742
- Publication date Mar 6, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Burton Jesse Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF OF A SEMICONDUCTOR DEVICE
- Publication number 20090039470
- Publication date Feb 12, 2009
- Nhat Dinh Vo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS
- Publication number 20070267755
- Publication date Nov 22, 2007
- Nhat D. Vo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS
- Publication number 20070267748
- Publication date Nov 22, 2007
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderable metal finish for integrated circuit package leads and me...
- Publication number 20060022313
- Publication date Feb 2, 2006
- Peng Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged semiconductor with coated leads and method therefore
- Publication number 20040041241
- Publication date Mar 4, 2004
- Nhat D. Vo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PACKAGED INTEGRATED CIRCUIT AND METHOD THEREFOR
- Publication number 20030106707
- Publication date Jun 12, 2003
- Nhat D. Vo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for connecting a semiconductor die to a substrate and met...
- Publication number 20020079595
- Publication date Jun 27, 2002
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Stress relief of a semiconductor device

Integrated circuit having pads and input/output (I/O) cells

Solderable metal finish for integrated circuit package leads and me...

Packaged semiconductor with coated leads and method therefore

Packaged integrated circuit and method therefor

Patents Applicationslast 30 patents

TIN-BASED WIREBOND STRUCTURES

Thermally Enhanced Electronic Component Packages with Through Mold...

STRESS RELIEF OF A SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS

INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS

Solderable metal finish for integrated circuit package leads and me...

Packaged semiconductor with coated leads and method therefore

PACKAGED INTEGRATED CIRCUIT AND METHOD THEREFOR

Apparatus for connecting a semiconductor die to a substrate and met...