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Molding machine for semiconductor package
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Patent number 5,501,587
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Issue date Mar 26, 1996
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Han-Mi Mold & Tool, Co., Ltd.
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Nho K. Kwak
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B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Mold for a semiconductor package
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Patent number 5,501,588
-
Issue date Mar 26, 1996
-
Han-Mi Mold & Tool Co., Ltd
-
Nho K. Kwak
-
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL