Nic Rossi

Person

Radio City, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Spot plated leadframe and IC bond pad via array design for copper wire
- Patent number 9,230,928
- Issue date Jan 5, 2016
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with corner pins
- Patent number 9,142,491
- Issue date Sep 22, 2015
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with reduced solder voiding
- Patent number 9,029,991
- Issue date May 12, 2015
- Conexant Systems, Inc.
- Robert W Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with thermal pad for higher power dissipation
- Patent number 8,552,540
- Issue date Oct 8, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded USB connector module with molded hood and LED light pipe
- Patent number 8,540,529
- Issue date Sep 24, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Systems and methods of tamper proof packaging of a semiconductor de...
- Patent number 8,455,990
- Issue date Jun 4, 2013
- Conexant Systems, Inc.
- Robert W Warren
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package with Corner Pins
- Publication number 20140091448
- Publication date Apr 3, 2014
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Sphere Array Package
- Publication number 20130256885
- Publication date Oct 3, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID VIA PINS FOR IMPROVED THERMAL AND ELECTRICAL CONDUCTIVITY
- Publication number 20130208424
- Publication date Aug 15, 2013
- Robert W. Warren
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper Stud Bump Wafer Level Package
- Publication number 20130087915
- Publication date Apr 11, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spot Plated Leadframe and IC Bond Pad Via Array Design for Copper Wire
- Publication number 20130062742
- Publication date Mar 14, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielded USB Connector Module with Molded Hood and LED Light Pipe
- Publication number 20130034990
- Publication date Feb 7, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Externally Wire Bondable Chip Scale Package in a System-in-Package...
- Publication number 20120326304
- Publication date Dec 27, 2012
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH THERMAL PAD FOR HIGHER POWER DISSIPATION
- Publication number 20120286408
- Publication date Nov 15, 2012
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Unpackaged and packaged IC stacked in a system-in-package module
- Publication number 20120241954
- Publication date Sep 27, 2012
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated led in system-in-package module
- Publication number 20120188738
- Publication date Jul 26, 2012
- Conexant Systems, Inc.
- Robert W. Warren
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor packages with reduced solder voiding
- Publication number 20120119341
- Publication date May 17, 2012
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and methods for improved heat dissipation in semiconductor...
- Publication number 20120104591
- Publication date May 3, 2012
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Heat Dissipation Using Thermal Conduits
- Publication number 20120032350
- Publication date Feb 9, 2012
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods of Improved Heat Dissipation with Variable Pitc...
- Publication number 20110001230
- Publication date Jan 6, 2011
- Conexant Systems, Inc.
- Jianjun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods of Tamper Proof Packaging of a Semiconductor De...
- Publication number 20100213590
- Publication date Aug 26, 2010
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Spot plated leadframe and IC bond pad via array design for copper wire

Semiconductor package with corner pins

Semiconductor packages with reduced solder voiding

Wafer level package with thermal pad for higher power dissipation

Shielded USB connector module with molded hood and LED light pipe

Systems and methods of tamper proof packaging of a semiconductor de...

Patents Applicationslast 30 patents

Semiconductor Package with Corner Pins

Copper Sphere Array Package

SOLID VIA PINS FOR IMPROVED THERMAL AND ELECTRICAL CONDUCTIVITY

Copper Stud Bump Wafer Level Package

Spot Plated Leadframe and IC Bond Pad Via Array Design for Copper Wire

Shielded USB Connector Module with Molded Hood and LED Light Pipe

Externally Wire Bondable Chip Scale Package in a System-in-Package...

WAFER LEVEL PACKAGE WITH THERMAL PAD FOR HIGHER POWER DISSIPATION

Unpackaged and packaged IC stacked in a system-in-package module

Integrated led in system-in-package module

Semiconductor packages with reduced solder voiding

Systems and methods for improved heat dissipation in semiconductor...

Systems and Methods for Heat Dissipation Using Thermal Conduits

Systems and Methods of Improved Heat Dissipation with Variable Pitc...

Systems and Methods of Tamper Proof Packaging of a Semiconductor De...