Nicholas Celia

Person

Avon, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Die bonding system with wafer lift and level assembly
- Patent number 11,791,197
- Issue date Oct 17, 2023
- MRSI Systems LLC
- Nicholas Samuel Celia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die placement head with turret
- Patent number 10,588,981
- Issue date Mar 17, 2020
- MRSI Systems LLC
- Nicholas Samuel Celia
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Thermo-compression bonding system, subsystems, and methods of use
- Patent number 9,911,710
- Issue date Mar 6, 2018
- MRSI Systems, LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SELF-ALIGNING TIP
- Publication number 20230223289
- Publication date Jul 13, 2023
- MRSI Systems LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDING SYSTEM WITH WAFER LIFT AND LEVEL ASSEMBLY
- Publication number 20230148356
- Publication date May 11, 2023
- MRSI Systems LLC
- Nicholas Samuel Celia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING SYSTEM WITH HEATED AUTOMATIC COLLET CHANGER
- Publication number 20220102187
- Publication date Mar 31, 2022
- MRSI Systems LLC
- Nicholas Samuel Celia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PLACEMENT HEAD WITH TURRET
- Publication number 20180323088
- Publication date Nov 8, 2018
- MRSI Systems, LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMO-COMPRESSION BONDING SYSTEM, SUBSYSTEMS, AND METHODS OF USE
- Publication number 20160126213
- Publication date May 5, 2016
- MRSI SYSTEMS LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR THERMO-COMPRESSION BONDING OF HIGH BUMP COUNT...
- Publication number 20150380379
- Publication date Dec 31, 2015
- MRSI Systems, LLC
- Cyriac Devasia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip device assembly machine
- Publication number 20050045914
- Publication date Mar 3, 2005
- Newport Corporation
- Edward Agranat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Nicholas Celia

Person

Patents Grantslast 30 patents

Die bonding system with wafer lift and level assembly

Die placement head with turret

Thermo-compression bonding system, subsystems, and methods of use

Patents Applicationslast 30 patents

SELF-ALIGNING TIP

DIE BONDING SYSTEM WITH WAFER LIFT AND LEVEL ASSEMBLY

DIE BONDING SYSTEM WITH HEATED AUTOMATIC COLLET CHANGER

DIE PLACEMENT HEAD WITH TURRET

THERMO-COMPRESSION BONDING SYSTEM, SUBSYSTEMS, AND METHODS OF USE

SYSTEM AND METHOD FOR THERMO-COMPRESSION BONDING OF HIGH BUMP COUNT...

Flip chip device assembly machine