Nicholas G. Koopman

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming dual height solder interconnections
- Patent number 5,251,806
- Issue date Oct 12, 1993
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium enhanced soldering and bonding of semiconductor device co...
- Patent number 5,225,711
- Issue date Jul 6, 1993
- International Business Machines Corporation
- Chin-An Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder mass having conductive encapsulating arrangement
- Patent number 5,130,779
- Issue date Jul 14, 1992
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium enhanced fluxless soldering and bonding of semiconductor...
- Patent number 5,048,744
- Issue date Sep 17, 1991
- International Business Machines Corporation
- Chin-An Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of brazing using low temperature braze alloy of gold-indium...
- Patent number 4,492,842
- Issue date Jan 8, 1985
- International Business Machines Corporation
- Nicholas G. Koopman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered metal film structures for LSI chip carriers adapted for sol...
- Patent number 4,463,059
- Issue date Jul 31, 1984
- International Business Machines Corporation
- Somnath Bhattacharya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder mound formation on substrates
- Patent number 4,434,434
- Issue date Feb 28, 1984
- International Business Machines Corporation
- Somnath Bhattacharya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for in-situ modification of solder comopsition
- Patent number 4,332,343
- Issue date Jun 1, 1982
- International Business Machines Corporation
- Nicholas G. Koopman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conduction-cooled circuit package
- Patent number 4,081,825
- Issue date Mar 28, 1978
- International Business Machines Corporation
- Nicholas George Koopman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making conduction-cooled circuit package
- Patent number 4,034,468
- Issue date Jul 12, 1977
- IBM Corporation
- Nicholas George Koopman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making conduction-cooled circuit package
- Patent number 4,034,469
- Issue date Jul 12, 1977
- IBM Corporation
- Nicholas George Koopman
- H01 - BASIC ELECTRIC ELEMENTS

Nicholas G. Koopman

Person

Patents Grantslast 30 patents

Method of forming dual height solder interconnections

Palladium enhanced soldering and bonding of semiconductor device co...

Solder mass having conductive encapsulating arrangement

Palladium enhanced fluxless soldering and bonding of semiconductor...

Process of brazing using low temperature braze alloy of gold-indium...

Layered metal film structures for LSI chip carriers adapted for sol...

Solder mound formation on substrates

Process for in-situ modification of solder comopsition

Conduction-cooled circuit package

Method for making conduction-cooled circuit package

Method of making conduction-cooled circuit package