Nicholas J. Salatino

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Penfiled, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for dicing a semiconductor wafer, a chip diced from a semico...
- Patent number 8,129,258
- Issue date Mar 6, 2012
- Xerox Corporation
- Paul A. Hosier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of a U-groove as an alternative to using a V-groove for protect...
- Patent number 6,955,989
- Issue date Oct 18, 2005
- Xerox Corporation
- Alain E. Perregaux
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for dicing of micro devices
- Patent number 6,291,317
- Issue date Sep 18, 2001
- Xerox Corporation
- Nicholas J. Salatino
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR DICING A SEMICONDUCTOR WAFER, A CHIP DICED FROM A SEMICO...
- Publication number 20110147898
- Publication date Jun 23, 2011
- Xerox Corporation
- PAUL A. HOSIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of a U-groove as an alternative to using a V-groove for protect...
- Publication number 20050221585
- Publication date Oct 6, 2005
- Xerox Corporation.
- Alain E. Perregaux
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Use of a U-groove as an alternative to using a V-groove for protect...
- Publication number 20030194864
- Publication date Oct 16, 2003
- Xerox Corporation.
- Alain E. Perregaux
- B28 - WORKING CEMENT, CLAY, OR STONE