Nicholas Neal

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
No mold shelf package design and process flow for advanced package...
- Patent number 12,087,731
- Issue date Sep 10, 2024
- Intel Corporation
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protruding SN substrate features for epoxy flow control
- Patent number 12,009,271
- Issue date Jun 11, 2024
- Intel Corporation
- Edvin Cetegen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with thermal insulation
- Patent number 11,942,393
- Issue date Mar 26, 2024
- Intel Corporation
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling solution including microchannel arrays and methods of formi...
- Patent number 11,901,262
- Issue date Feb 13, 2024
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
No mold shelf package design and process flow for advanced package...
- Patent number 11,901,333
- Issue date Feb 13, 2024
- Intel Corporation
- Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full package vapor chamber with IHS
- Patent number 11,832,419
- Issue date Nov 28, 2023
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct liquid micro jet (DLMJ) structures for addressing thermal pe...
- Patent number 11,804,418
- Issue date Oct 31, 2023
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Corner guard for improved electroplated first level interconnect bu...
- Patent number 11,776,864
- Issue date Oct 3, 2023
- Intel Corporation
- Jacob Vehonsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for cored substrates
- Patent number 11,640,929
- Issue date May 2, 2023
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate thermal layer for heat spreader connection
- Patent number 11,594,463
- Issue date Feb 28, 2023
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal bump networks for integrated circuit device assemblies
- Patent number 11,587,843
- Issue date Feb 21, 2023
- Intel Corporation
- Prasad Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming multi-chip package structures
- Patent number 10,553,548
- Issue date Feb 4, 2020
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with an integrated heat spreader having in...
- Patent number 10,461,011
- Issue date Oct 29, 2019
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
- Publication number 20240258183
- Publication date Aug 1, 2024
- Intel Corporation
- Edvin CETEGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20240136326
- Publication date Apr 25, 2024
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...
- Publication number 20230343723
- Publication date Oct 26, 2023
- Intel Corporation
- Nicholas NEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20230238355
- Publication date Jul 27, 2023
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE THERMAL MATRIX
- Publication number 20210249330
- Publication date Aug 12, 2021
- Intel Corporation
- Nicholas S. Haehn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH THERMAL INSULATION
- Publication number 20210242107
- Publication date Aug 5, 2021
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULL PACKAGE VAPOR CHAMBER WITH IHS
- Publication number 20210195798
- Publication date Jun 24, 2021
- Intel Corporation
- Nicholas NEAL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20210104490
- Publication date Apr 8, 2021
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ATTACHMENT AND/OR STOP STRUCTURES
- Publication number 20210066162
- Publication date Mar 4, 2021
- Intel Corporation
- Sergio A. CHAN ARGUEDAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...
- Publication number 20210035921
- Publication date Feb 4, 2021
- Intel Corporation
- Nicholas NEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
- Publication number 20210020531
- Publication date Jan 21, 2021
- Intel Corporation
- Edvin CETEGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...
- Publication number 20210020532
- Publication date Jan 21, 2021
- Intel Corporation
- Jacob VEHONSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SOLUTION INCLUDING MICROCHANNEL ARRAYS AND METHODS OF FORMI...
- Publication number 20200243418
- Publication date Jul 30, 2020
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DIRECT LIQUID MICRO JET (DLMJ) STRUCTURES FOR ADDRESSING THERMAL PE...
- Publication number 20200227341
- Publication date Jul 16, 2020
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR CORED SUBSTRATES
- Publication number 20200203256
- Publication date Jun 25, 2020
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL BUMP NETWORKS FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES
- Publication number 20200194330
- Publication date Jun 18, 2020
- Intel Corporation
- Prasad Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE THERMAL LAYER FOR HEAT SPREADER CONNECTION
- Publication number 20200118902
- Publication date Apr 16, 2020
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE WITH AN INTEGRATED HEAT SPREADER
- Publication number 20190198416
- Publication date Jun 27, 2019
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MULTI-CHIP PACKAGE STRUCTURES
- Publication number 20190006291
- Publication date Jan 3, 2019
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS

Nicholas Neal

Person

Patents Grantslast 30 patents

No mold shelf package design and process flow for advanced package...

Protruding SN substrate features for epoxy flow control

Substrate with thermal insulation

Cooling solution including microchannel arrays and methods of formi...

No mold shelf package design and process flow for advanced package...

Full package vapor chamber with IHS

Direct liquid micro jet (DLMJ) structures for addressing thermal pe...

Corner guard for improved electroplated first level interconnect bu...

Thermal management solutions for cored substrates

Substrate thermal layer for heat spreader connection

Thermal bump networks for integrated circuit device assemblies

Methods of forming multi-chip package structures

Microelectronics package with an integrated heat spreader having in...

Patents Applicationslast 30 patents

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

COMPOSITE THERMAL MATRIX

SUBSTRATE WITH THERMAL INSULATION

FULL PACKAGE VAPOR CHAMBER WITH IHS

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

SEMICONDUCTOR PACKAGE WITH ATTACHMENT AND/OR STOP STRUCTURES

SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...

COOLING SOLUTION INCLUDING MICROCHANNEL ARRAYS AND METHODS OF FORMI...

DIRECT LIQUID MICRO JET (DLMJ) STRUCTURES FOR ADDRESSING THERMAL PE...

THERMAL MANAGEMENT SOLUTIONS FOR CORED SUBSTRATES

THERMAL BUMP NETWORKS FOR INTEGRATED CIRCUIT DEVICE ASSEMBLIES

SUBSTRATE THERMAL LAYER FOR HEAT SPREADER CONNECTION

MICROELECTRONICS PACKAGE WITH AN INTEGRATED HEAT SPREADER

METHODS OF FORMING MULTI-CHIP PACKAGE STRUCTURES