Nicholas Palmer

Follow

Person

Rutland, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual interposer packaging for high density interconnect
- Patent number 6,812,485
- Issue date Nov 2, 2004
- Hewlett-Packard Development Company, L.P.
- Sharad M. Shah
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
System and method for mounting processor and heat transfer mechanism
- Publication number 20050068741
- Publication date Mar 31, 2005
- Douglas A. Bailey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual interposer packaging for high density interconnect
- Publication number 20030123231
- Publication date Jul 3, 2003
- Sharad M. Shah
- G01 - MEASURING TESTING