Nick Xin

Person

Shanghai City, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semi-flex component carrier with dielectric material having high el...
- Patent number 12,058,810
- Issue date Aug 6, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with improved bending performance
- Patent number 11,672,079
- Issue date Jun 6, 2023
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement with central carrier and two opposing layer stacks, com...
- Patent number 11,670,613
- Issue date Jun 6, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-flexible component carrier with stepped layer structure
- Patent number 11,589,462
- Issue date Feb 21, 2023
- AT&S(China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 11,291,119
- Issue date Mar 29, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-flex component carrier with dielectric material having high el...
- Patent number 11,284,508
- Issue date Mar 22, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress relief opening for reducing warpage of component carriers
- Patent number 11,219,120
- Issue date Jan 4, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier comprising dielectric structures with different p...
- Patent number 11,116,075
- Issue date Sep 7, 2021
- AT&S (China) Co. Ltd.
- Kim Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier
- Publication number 20230180383
- Publication date Jun 8, 2023
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Surrounding an...
- Publication number 20220256686
- Publication date Aug 11, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Having High El...
- Publication number 20220159828
- Publication date May 19, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Flexible Component Carrier With Stepped Layer Structure
- Publication number 20220039259
- Publication date Feb 3, 2022
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Improved Bending Performance
- Publication number 20210368613
- Publication date Nov 25, 2021
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement With Central Carrier And Two Opposing Layer Stacks, Com...
- Publication number 20210202427
- Publication date Jul 1, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Having High El...
- Publication number 20210045235
- Publication date Feb 11, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Surrounding an...
- Publication number 20210045249
- Publication date Feb 11, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Comprising Dielectric Structures With Different P...
- Publication number 20200281071
- Publication date Sep 3, 2020
- AT&S (China) Co. Ltd.
- Kim Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Improved Bending Performance
- Publication number 20200154558
- Publication date May 14, 2020
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stress Relief Opening for Reducing Warpage of Component Carriers
- Publication number 20200100358
- Publication date Mar 26, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Semi-flex component carrier with dielectric material having high el...

Component carrier with improved bending performance

Arrangement with central carrier and two opposing layer stacks, com...

Semi-flexible component carrier with stepped layer structure

Semi-flex component carrier with dielectric material surrounding an...

Semi-flex component carrier with dielectric material having high el...

Stress relief opening for reducing warpage of component carriers

Component carrier comprising dielectric structures with different p...

Patents Applicationslast 30 patents

Component Carrier

Semi-Flex Component Carrier With Dielectric Material Surrounding an...

Semi-Flex Component Carrier With Dielectric Material Having High El...

Semi-Flexible Component Carrier With Stepped Layer Structure

Component Carrier With Improved Bending Performance

Arrangement With Central Carrier And Two Opposing Layer Stacks, Com...

Semi-Flex Component Carrier With Dielectric Material Having High El...

Semi-Flex Component Carrier With Dielectric Material Surrounding an...

Component Carrier Comprising Dielectric Structures With Different P...

Component Carrier With Improved Bending Performance

Stress Relief Opening for Reducing Warpage of Component Carriers