Nick Y.M. Shen

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Chu-Pei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating an integrated CMOS-MEMS device
- Patent number 8,012,785
- Issue date Sep 6, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chih Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for wafer bonding
- Patent number 7,732,299
- Issue date Jun 8, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fa-Yuan Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Method Of Fabricating An Integrated CMOS-MEMS Device
- Publication number 20100273286
- Publication date Oct 28, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chih Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Process For Wafer Bonding
- Publication number 20080194076
- Publication date Aug 14, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fa-Yuan Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY