Nicolas Boyer

Person

Canton d'Orford, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Nanofiller in an optical interface
- Patent number 10,338,325
- Issue date Jul 2, 2019
- International Business Machines Corporation
- Barnim Alexander Janta-Polczynski
- G02 - OPTICS
Information Patent Grant
Optical interconnect attach to photonic device with partitioning ad...
- Patent number 10,302,869
- Issue date May 28, 2019
- International Business Machines Corporation
- Barnim Alexander Janta-Polczynski
- G02 - OPTICS
Information Patent Grant
Optical interconnect attach to photonic device with partitioning ad...
- Patent number 10,295,749
- Issue date May 21, 2019
- International Business Machines Corporation
- Barnim Alexander Janta-Polczynski
- G02 - OPTICS
Information Patent Grant
Fiber pigtail assembly with integrated lid enabling optical fiber m...
- Patent number 9,810,864
- Issue date Nov 7, 2017
- International Business Machines Corporation
- Tymon Barwicz
- G02 - OPTICS
Information Patent Grant
Component assembly apparatus
- Patent number 9,684,133
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Tymon Barwicz
- G02 - OPTICS
Information Patent Grant
Bondline control fixture and method of affixing first and second co...
- Patent number 9,662,830
- Issue date May 30, 2017
- International Business Machines Corporation
- Tymon Barwicz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bondline control fixture and method of affixing first and second co...
- Patent number 9,656,420
- Issue date May 23, 2017
- International Business Machines Corporation
- Tymon Barwicz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fiber pigtail assembly with integrated lid enabling optical fiber m...
- Patent number 9,651,747
- Issue date May 16, 2017
- International Business Machines Corporation
- Tymon Barwicz
- G02 - OPTICS
Information Patent Grant
Component and chip assembly structure for high yield parallelized f...
- Patent number 9,568,682
- Issue date Feb 14, 2017
- International Business Machines Corporation
- Tymon Barwicz
- G02 - OPTICS
Information Patent Grant
System for removing an electronic component from a substrate
- Patent number 9,338,935
- Issue date May 10, 2016
- International Business Machines Corporation
- Yvan Bessette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing an electronic component from a substrate
- Patent number 8,925,170
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Yvan Bessette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FIBER PIGTAIL ASSEMBLY WITH INTEGRATED LID ENABLING OPTICAL FIBER M...
- Publication number 20170242207
- Publication date Aug 24, 2017
- International Business Machines Corporation
- Tymon Barwicz
- G02 - OPTICS
Information Patent Application
BONDLINE CONTROL FIXTURE AND METHOD OF AFFIXING FIRST AND SECOND CO...
- Publication number 20160318240
- Publication date Nov 3, 2016
- International Business Machines Corporation
- Tymon Barwicz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
BONDLINE CONTROL FIXTURE AND METHOD OF AFFIXING FIRST AND SECOND CO...
- Publication number 20160318241
- Publication date Nov 3, 2016
- International Business Machines Corporation
- Tymon Barwicz
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
COMPONENT ASSEMBLY APPARATUS
- Publication number 20160085044
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Tymon Barwicz
- G02 - OPTICS
Information Patent Application
SYSTEM FOR REMOVING AN ELECTRONIC COMPONENT FROM A SUBSTRATE
- Publication number 20150089802
- Publication date Apr 2, 2015
- International Business Machines Corporation
- Yvan Bessette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR REMOVING AN ELECTRONIC COMPONENT FROM A SUBST...
- Publication number 20120266459
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Yvan Bessette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Nicolas Boyer

Person

Patents Grantslast 30 patents

Nanofiller in an optical interface

Optical interconnect attach to photonic device with partitioning ad...

Optical interconnect attach to photonic device with partitioning ad...

Fiber pigtail assembly with integrated lid enabling optical fiber m...

Component assembly apparatus

Bondline control fixture and method of affixing first and second co...

Bondline control fixture and method of affixing first and second co...

Fiber pigtail assembly with integrated lid enabling optical fiber m...

Component and chip assembly structure for high yield parallelized f...

System for removing an electronic component from a substrate

Method for removing an electronic component from a substrate

Patents Applicationslast 30 patents

FIBER PIGTAIL ASSEMBLY WITH INTEGRATED LID ENABLING OPTICAL FIBER M...

BONDLINE CONTROL FIXTURE AND METHOD OF AFFIXING FIRST AND SECOND CO...

BONDLINE CONTROL FIXTURE AND METHOD OF AFFIXING FIRST AND SECOND CO...

COMPONENT ASSEMBLY APPARATUS

SYSTEM FOR REMOVING AN ELECTRONIC COMPONENT FROM A SUBSTRATE

SYSTEM AND METHOD FOR REMOVING AN ELECTRONIC COMPONENT FROM A SUBST...