Nicolas E. Stauff

Person

  • Oak Park, IL, US

Patents Grantslast 30 patents

  • Information Patent Grant

    Heat transfer module

    • Patent number 11,769,600
    • Issue date Sep 26, 2023
    • UChicago Argonne, LLC
    • Nicolas E. Stauff
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Grant

    Neutron moderation modules

    • Patent number 11,443,858
    • Issue date Sep 13, 2022
    • UChicago Argonne, LLC
    • Yinbin Miao
    • G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
  • Information Patent Grant

    High-temperature and/or high pressure gas enclosure

    • Patent number 11,378,230
    • Issue date Jul 5, 2022
    • UChicago Argonne, LLC
    • Yinbin Miao
    • F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS

Patents Applicationslast 30 patents

  • Information Patent Application

    HEAT TRANSFER MODULE

    • Publication number 20220068513
    • Publication date Mar 3, 2022
    • UChicago Argonne, LLC
    • Nicolas E. Stauff
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    MODERATION MODULES

    • Publication number 20220013243
    • Publication date Jan 13, 2022
    • UChicago Argonne, LLC
    • Yinbin Miao
    • G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
  • Information Patent Application

    HYDROGEN PERMEATION BARRIER COATINGS AND METHODS OF MAKING THE SAME

    • Publication number 20220010429
    • Publication date Jan 13, 2022
    • UChicago Argonne, LLC
    • Abdellatif M. Yacout
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    HIGH-TEMPERATURE AND/OR HIGH PRESSURE GAS ENCLOSURE

    • Publication number 20220010929
    • Publication date Jan 13, 2022
    • UChicago Argonne, LLC
    • Yinbin Miao
    • F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS