Nicolas Heuck

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Cremlingen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing an integral join and automatic placement machine
- Patent number 11,081,464
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Nicolas Heuck
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a material-bonding connection between a semico...
- Patent number 9,659,793
- Issue date May 23, 2017
- Infineon Technologies AG
- Nicolas Heuck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-sintered semiconductor die structure
- Patent number 8,835,299
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Producing an Integral Join and Automatic Placement Machine
- Publication number 20160351533
- Publication date Dec 1, 2016
- INFINEON TECHNOLOGIES AG
- Nicolas Heuck
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for Producing a Connecting Medium on an Assembly Partner, Me...
- Publication number 20160225735
- Publication date Aug 4, 2016
- INFINEON TECHNOLOGIES AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing a Material-Bonding Connection between a Semico...
- Publication number 20160148819
- Publication date May 26, 2016
- INFINEON TECHNOLOGIES AG
- Nicolas Heuck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A DRIED PASTE LAYER, METHOD FOR PRODUCING A SI...
- Publication number 20150257280
- Publication date Sep 10, 2015
- INFINEON TECHNOLOGIES AG
- Alexander Ciliox
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Pre-Sintered Semiconductor Die Structure
- Publication number 20140061909
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS