Nicolas J. BRIGHT

Person

Arlington, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chamber body design architecture for next generation advanced plasm...
- Patent number 12,049,961
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Bradley J. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 12,046,449
- Issue date Jul 23, 2024
- Applied Materials, Inc.
- Yue Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamber body design architecture for next generation advanced plasm...
- Patent number 11,333,246
- Issue date May 17, 2022
- Applied Materials, Inc.
- Andrew Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post etch treatment (PET) of a low-K dielectric film
- Patent number 8,871,650
- Issue date Oct 28, 2014
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide etch process with high selectivity to nitride suitable for us...
- Patent number 6,194,325
- Issue date Feb 27, 2001
- Applied Materials Inc.
- Chan Lon Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etch apparatus with heated scavenging surfaces
- Patent number 6,083,412
- Issue date Jul 4, 2000
- Applied Materials, Inc.
- Michael Rice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etch apparatus with heated scavenging surfaces
- Patent number 5,770,099
- Issue date Jun 23, 1998
- Applied Materials, Inc.
- Michael Rice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck usable in high density plasma
- Patent number 5,583,737
- Issue date Dec 10, 1996
- Applied Materials, Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck usable in high density plasma
- Patent number 5,539,609
- Issue date Jul 23, 1996
- Applied Materials, Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etch apparatus with heated scavenging surfaces
- Patent number 5,477,975
- Issue date Dec 26, 1995
- Michael Rice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck for high power plasma processing
- Patent number 5,350,479
- Issue date Sep 27, 1994
- Applied Materials, Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RADIO FREQUENCY DIVERTER ASSEMBLY ENABLING ON-DEMAND DIFFERENT SPAT...
- Publication number 20240290578
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Kartik RAMASWAMY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR IMPLEMENTING A MICRO PULSING SCHEME USING DU...
- Publication number 20240177968
- Publication date May 30, 2024
- Applied Materials, Inc.
- A N M Wasekul AZAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20240162008
- Publication date May 16, 2024
- Applied Materials, Inc.
- Yue GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCANNING IMPEDANCE MEASUREMENT IN A RADIO FREQUENCY PLASMA PROCESSI...
- Publication number 20240079212
- Publication date Mar 7, 2024
- Applied Materials, Inc.
- Yue GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20230343555
- Publication date Oct 26, 2023
- Yue GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUXILIARY PLASMA SOURCE FOR ROBUST IGNITION AND RESTRIKES IN A PLAS...
- Publication number 20230187176
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Kartik Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMBER BODY DESIGN ARCHITECTURE FOR NEXT GENERATION ADVANCED PLASM...
- Publication number 20220213959
- Publication date Jul 7, 2022
- Applied Materials, Inc.
- Bradley J. HOWARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM WAFER TEMPERATURE ACHIEVEMENT IN UNSYMMETRIC CHAMBER ENVIRO...
- Publication number 20170178758
- Publication date Jun 22, 2017
- Applied Materials, Inc.
- Sungwon HA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHAMBER BODY DESIGN ARCHITECTURE FOR NEXT GENERATION ADVANCED PLASM...
- Publication number 20160215883
- Publication date Jul 28, 2016
- Applied Materials, Inc.
- ANDREW NGUYEN
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
POST ETCH TREATMENT (PET) OF A LOW-K DIELECTRIC FILM
- Publication number 20130109187
- Publication date May 2, 2013
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS

Nicolas J. BRIGHT

Person

Patents Grantslast 30 patents

Chamber body design architecture for next generation advanced plasm...

Methods and apparatus for processing a substrate

Chamber body design architecture for next generation advanced plasm...

Post etch treatment (PET) of a low-K dielectric film

Oxide etch process with high selectivity to nitride suitable for us...

Plasma etch apparatus with heated scavenging surfaces

Plasma etch apparatus with heated scavenging surfaces

Electrostatic chuck usable in high density plasma

Electrostatic chuck usable in high density plasma

Plasma etch apparatus with heated scavenging surfaces

Electrostatic chuck for high power plasma processing

Patents Applicationslast 30 patents

RADIO FREQUENCY DIVERTER ASSEMBLY ENABLING ON-DEMAND DIFFERENT SPAT...

SYSTEM AND METHODS FOR IMPLEMENTING A MICRO PULSING SCHEME USING DU...

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

SCANNING IMPEDANCE MEASUREMENT IN A RADIO FREQUENCY PLASMA PROCESSI...

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

AUXILIARY PLASMA SOURCE FOR ROBUST IGNITION AND RESTRIKES IN A PLAS...

CHAMBER BODY DESIGN ARCHITECTURE FOR NEXT GENERATION ADVANCED PLASM...

UNIFORM WAFER TEMPERATURE ACHIEVEMENT IN UNSYMMETRIC CHAMBER ENVIRO...

CHAMBER BODY DESIGN ARCHITECTURE FOR NEXT GENERATION ADVANCED PLASM...

POST ETCH TREATMENT (PET) OF A LOW-K DIELECTRIC FILM