Nicolas R. Watts

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of embedding passive component within via
- Patent number 8,487,446
- Issue date Jul 16, 2013
- Intel Corporation
- Todd B Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic depositon and via filling in coreless substrate proces...
- Patent number 8,127,979
- Issue date Mar 6, 2012
- Intel Corporation
- Tao Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PASSIVE WITHIN VIA
- Publication number 20130249112
- Publication date Sep 26, 2013
- Todd B. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC DEPOSITON AND VIA FILLING IN CORELESS SUBSTRATE PROCES...
- Publication number 20120074209
- Publication date Mar 29, 2012
- Tao WU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...