Niels Oeschler

Person

Moehnesee, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for bending a substrate
- Patent number 10,600,658
- Issue date Mar 24, 2020
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing a semiconductor substrate
- Patent number 10,475,668
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for positioning a semiconductor chip on a carrier and method...
- Patent number 10,020,278
- Issue date Jul 10, 2018
- Infineon Technologies AG
- Niels Oeschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, method for producing a semiconductor chip and m...
- Patent number 9,741,639
- Issue date Aug 22, 2017
- Infineon Technologies AG
- Frank Umbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-sintered semiconductor die structure
- Patent number 8,835,299
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including diffusion soldered layer on sintered...
- Patent number 8,736,052
- Issue date May 27, 2014
- Infineon Technologies AG
- Niels Oeschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including excess solder
- Patent number 8,466,548
- Issue date Jun 18, 2013
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Method for Bending a Substrate
- Publication number 20200027752
- Publication date Jan 23, 2020
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Processing a Semiconductor Substrate
- Publication number 20190006193
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Positioning a Semiconductor Chip on a Carrier and Method...
- Publication number 20170025373
- Publication date Jan 26, 2017
- INFINEON TECHNOLOGIES AG
- Niels Oeschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP AND M...
- Publication number 20140077376
- Publication date Mar 20, 2014
- Frank Umbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Sintered Semiconductor Die Structure
- Publication number 20140061909
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Roland Speckels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DIFFUSION SOLDERED LAYER ON SINTERED...
- Publication number 20130049204
- Publication date Feb 28, 2013
- INFINEON TECHNOLOGIES AG
- Niels Oeschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING EXCESS SOLDER
- Publication number 20120306087
- Publication date Dec 6, 2012
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS

Niels Oeschler

Person

Patents Grantslast 30 patents

Apparatus and method for bending a substrate

Apparatus and method for processing a semiconductor substrate

Method for positioning a semiconductor chip on a carrier and method...

Semiconductor chip, method for producing a semiconductor chip and m...

Pre-sintered semiconductor die structure

Semiconductor device including diffusion soldered layer on sintered...

Semiconductor device including excess solder

Patents Applicationslast 30 patents

Apparatus and Method for Bending a Substrate

Apparatus and Method for Processing a Semiconductor Substrate

Method for Positioning a Semiconductor Chip on a Carrier and Method...

SEMICONDUCTOR CHIP, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP AND M...

Pre-Sintered Semiconductor Die Structure

SEMICONDUCTOR DEVICE INCLUDING DIFFUSION SOLDERED LAYER ON SINTERED...

SEMICONDUCTOR DEVICE INCLUDING EXCESS SOLDER