Nien-Fang Wu

Person

Chiayi City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of fabricating the same die stack structure and semiconduct...
- Patent number 12,119,328
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,057,439
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure, semiconductor structure and method of fabricat...
- Patent number 12,015,013
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,810,897
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable inductor
- Patent number 11,756,731
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,742,297
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with antenna element
- Patent number 11,705,411
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,502,062
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,322,477
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 11,264,362
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of forming the same
- Patent number 11,056,438
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,024,605
- Issue date Jun 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with antenna element
- Patent number 11,004,809
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 10,937,719
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with antenna element
- Patent number 10,312,203
- Issue date Jun 4, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable inductor
- Patent number 10,269,489
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing a semiconductor device having scribe lines
- Patent number 9,728,477
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Nien-Fang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof having gua...
- Patent number 9,379,067
- Issue date Jun 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a chip substrate, a mold, and a buf...
- Patent number 9,343,385
- Issue date May 17, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Nien-Fang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having guard ring structure and methods of ma...
- Patent number 9,245,842
- Issue date Jan 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240427081
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ning Weng
- G02 - OPTICS
Information Patent Application
SILICON-BASED OPTICAL COMPONENT AND METHOD OF FORMING THE SAME
- Publication number 20240411093
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- G02 - OPTICS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20240387440
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240355782
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240297151
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240264388
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...
- Publication number 20240170350
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING THE SAME DIE STACK STRUCTURE AND SEMICONDUCT...
- Publication number 20240021584
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20230378131
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE INDUCTOR AND METHODS OF MANUFACTURE
- Publication number 20230368972
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufactoring Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230352419
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH ANTENNA ELEMENT
- Publication number 20230317645
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ping CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages
- Publication number 20230067035
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220352109
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220189918
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACK STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICAT...
- Publication number 20220181301
- Publication date Jun 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210375826
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210296251
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20210288030
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH ANTENNA ELEMENT
- Publication number 20210265289
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ping CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210098420
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF FORMING THE SAME
- Publication number 20200411445
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20200381396
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH ANTENNA ELEMENT
- Publication number 20190279951
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Ping CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable Inductor
- Publication number 20190252117
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20180269139
- Publication date Sep 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH ANTENNA ELEMENT
- Publication number 20180166405
- Publication date Jun 14, 2018
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Yung-Ping CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160240453
- Publication date Aug 18, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- NIEN-FANG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF HAVING GUA...
- Publication number 20160133583
- Publication date May 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160035639
- Publication date Feb 4, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- NIEN-FANG WU
- H01 - BASIC ELECTRIC ELEMENTS

Nien-Fang Wu

Person

Patents Grantslast 30 patents

Methods of fabricating the same die stack structure and semiconduct...

Integrated circuit packages

Die stack structure, semiconductor structure and method of fabricat...

Package structure and method of fabricating the same

Programmable inductor

Semiconductor packages

Chip package with antenna element

Integrated circuit package and method

Package structure and method of fabricating the same

Semiconductor structure and method of fabricating the same

Semiconductor packages and method of forming the same

Integrated circuit package and method

Chip package with antenna element

Package structure and method of fabricating the same

Structure and formation method of chip package with antenna element

Programmable inductor

Method of manufacturing a semiconductor device having scribe lines

Semiconductor devices and methods of manufacture thereof having gua...

Semiconductor device comprising a chip substrate, a mold, and a buf...

Semiconductor devices having guard ring structure and methods of ma...

Patents Applicationslast 30 patents

OPTICAL DEVICE AND METHOD OF MANUFACTURE

SILICON-BASED OPTICAL COMPONENT AND METHOD OF FORMING THE SAME

MANUFACTURING METHOD OF PACKAGE STRUCTURE

INTEGRATED CIRCUIT PACKAGES

METHODS OF FABRICATING PACKAGE STRUCTURE

PACKAGE DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...

METHODS OF FABRICATING THE SAME DIE STACK STRUCTURE AND SEMICONDUCT...

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PROGRAMMABLE INDUCTOR AND METHODS OF MANUFACTURE

SEMICONDUCTOR PACKAGES

PACKAGE STRUCTURE WITH ANTENNA ELEMENT

Integrated Circuit Packages

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

DIE STACK STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICAT...

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES

Integrated Circuit Package and Method

CHIP PACKAGE WITH ANTENNA ELEMENT

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES AND METHOD OF FORMING THE SAME

Integrated Circuit Package and Method

CHIP PACKAGE WITH ANTENNA ELEMENT

Programmable Inductor

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH ANTENNA ELEMENT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF HAVING GUA...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME