Nien-Ming Wang

Follow

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for improving integrated circuits bonding firmness
- Patent number 6,599,578
- Issue date Jul 29, 2003
- Industrial Technology Research Institute
- Jeng-Jie Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving integrated circuits bonding firmness
- Patent number 6,444,295
- Issue date Sep 3, 2002
- Industrial Technology Research Institute
- Jeng-Jie Peng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for improving integrated circuits bonding firmness
- Publication number 20020197458
- Publication date Dec 26, 2002
- Industrial Technology Research Institute
- Jeng-Jie Peng
- H01 - BASIC ELECTRIC ELEMENTS