Nikhil M. Murdeshwar

Person

Apalachin, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor copper bond pad surface protection
- Patent number 7,199,475
- Issue date Apr 3, 2007
- Kulicke and Soffa Industries, Inc.
- Timothy W. Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor copper bond pad surface protection
- Patent number 6,885,104
- Issue date Apr 26, 2005
- Kulicke and Soffa Investments, Inc.
- Timothy W. Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding to dual metal covered pad surfaces
- Patent number 6,759,597
- Issue date Jul 6, 2004
- International Business Machines Corporation
- Lawrence Richard Cutting
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor copper bond pad surface protection
- Patent number 6,534,877
- Issue date Mar 18, 2003
- Kulicke & Soffa Investments, Inc.
- Timothy W. Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding to dual metal covered pad surfaces
- Patent number 6,519,845
- Issue date Feb 18, 2003
- International Business Machines Corporation
- Lawrence Richard Cutting
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor copper bond pad surface protection
- Patent number 6,413,576
- Issue date Jul 2, 2002
- Kulicke & Soffa Investments, Inc.
- Timothy W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor copper band pad surface protection
- Patent number 6,352,743
- Issue date Mar 5, 2002
- Kulicke & Soffa Investments, Inc.
- Timothy W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of size and heat affected zone for fine pitch wire bonding
- Patent number 6,267,290
- Issue date Jul 31, 2001
- International Business Machines Corporation
- Nikhil M. Murdeshwar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective wafer-level testing and burn-in
- Patent number 6,255,208
- Issue date Jul 3, 2001
- International Business Machines Corporation
- William Emmett Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of size and heat affected zone for fine pitch wire bonding
- Patent number 6,180,891
- Issue date Jan 30, 2001
- International Business Machines Corporation
- Nikhil M. Murdeshwar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor copper bond pad surface protection
- Publication number 20050181191
- Publication date Aug 18, 2005
- Kulicke & Soffa Investments, Inc.
- Timothy W. Ellis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor copper bond pad surface protection
- Publication number 20020168845
- Publication date Nov 14, 2002
- Timothy W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor copper bond pad surface protection
- Publication number 20020135077
- Publication date Sep 26, 2002
- Timothy W. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COPPER BOND PAD SURFACE PROTECTION
- Publication number 20020054955
- Publication date May 9, 2002
- TIMOTHY W. ELLIS
- H01 - BASIC ELECTRIC ELEMENTS

Nikhil M. Murdeshwar

Person

Patents Grantslast 30 patents

Semiconductor copper bond pad surface protection

Semiconductor copper bond pad surface protection

Wire bonding to dual metal covered pad surfaces

Semiconductor copper bond pad surface protection

Wire bonding to dual metal covered pad surfaces

Semiconductor copper bond pad surface protection

Semiconductor copper band pad surface protection

Control of size and heat affected zone for fine pitch wire bonding

Selective wafer-level testing and burn-in

Control of size and heat affected zone for fine pitch wire bonding

Patents Applicationslast 30 patents

Semiconductor copper bond pad surface protection

Semiconductor copper bond pad surface protection

Semiconductor copper bond pad surface protection

SEMICONDUCTOR COPPER BOND PAD SURFACE PROTECTION