Nikunj P. Patel

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-component integrated heat spreader for multi-chip packages
- Patent number 9,330,999
- Issue date May 3, 2016
- Intel Corporation
- Thomas J. Fitzgerald
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SINTERED HEAT SPREADERS WITH INSERTS
- Publication number 20190027379
- Publication date Jan 24, 2019
- Intel Corporation
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES
- Publication number 20150357258
- Publication date Dec 10, 2015
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS