Nina Biddle

Person

Coleford, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming board assembly with chemical vapor deposition di...
- Patent number 11,538,732
- Issue date Dec 27, 2022
- Microchip Technology Caldicot Limited
- Philip Andrew Swire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical vapor deposition diamond (CVDD) wires for thermal transport
- Patent number 11,488,888
- Issue date Nov 1, 2022
- Microchip Technology Caldicot Limited
- Philip Andrew Swire
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flipped-conductor-patch lamination for ultra fine-line substrate cr...
- Patent number 11,432,402
- Issue date Aug 30, 2022
- Microchip Technology Caldicot Limited
- John Adam Tracy deMercleden Smithells
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board assembly with chemical vapor deposition diamond (CVDD) window...
- Patent number 11,189,543
- Issue date Nov 30, 2021
- Microchip Technology Caldicot Limited
- Philip Andrew Swire
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PCB STACK WITH EMBEDDED COMPONENT PACKAGE AND SINTERED VIAS
- Publication number 20240276637
- Publication date Aug 15, 2024
- Microchip Technology Caldicot Limited
- George Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Forming Flipped-Conductor-Patch
- Publication number 20220361329
- Publication date Nov 10, 2022
- Microchip Technology Caldicot Limited
- John Adam Tracy deMercleden Smithells
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming Board Assembly with Chemical Vapor Deposition Di...
- Publication number 20220028753
- Publication date Jan 27, 2022
- Microchip Technology Caldicot Limited
- Philip Andrew Swire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical Vapor Deposition Diamond (CVDD) Wires for Thermal Transport
- Publication number 20210143080
- Publication date May 13, 2021
- Microsemi Semiconductor Limited
- Philip Andrew Swire
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Flipped-Conductor-Patch Lamination for Ultra Fine-Line Substrate Cr...
- Publication number 20210092842
- Publication date Mar 25, 2021
- Microsemi Semiconductor Limited
- John Adam Tracy deMercleden Smithells
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Board Assembly with Chemical Vapor Deposition Diamond (CVDD) Window...
- Publication number 20210035883
- Publication date Feb 4, 2021
- Microsemi Semiconductor Limited
- Philip Andrew Swire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flipped-Conductor-Patch Lamination for Ultra Fine-Line Substrate Cr...
- Publication number 20200120797
- Publication date Apr 16, 2020
- Microsemi Semiconductor Limited
- John Adam Tracy deMercleden Smithells
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Nina Biddle

Person

Patents Grantslast 30 patents

Method for forming board assembly with chemical vapor deposition di...

Chemical vapor deposition diamond (CVDD) wires for thermal transport

Flipped-conductor-patch lamination for ultra fine-line substrate cr...

Board assembly with chemical vapor deposition diamond (CVDD) window...

Patents Applicationslast 30 patents

PCB STACK WITH EMBEDDED COMPONENT PACKAGE AND SINTERED VIAS

Method for Forming Flipped-Conductor-Patch

Method for forming Board Assembly with Chemical Vapor Deposition Di...

Chemical Vapor Deposition Diamond (CVDD) Wires for Thermal Transport

Flipped-Conductor-Patch Lamination for Ultra Fine-Line Substrate Cr...

Board Assembly with Chemical Vapor Deposition Diamond (CVDD) Window...

Flipped-Conductor-Patch Lamination for Ultra Fine-Line Substrate Cr...