Ning-Cheng Lee

Person

New Hartford, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 12,090,579
- Issue date Sep 17, 2024
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SnBi and SnIn solder alloys
- Patent number 11,999,018
- Issue date Jun 4, 2024
- Indium Corporation
- Francis M. Mutuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preparing graphite sheets with piercing treatment to enh...
- Patent number 11,807,536
- Issue date Nov 7, 2023
- Indium Corporation
- Hongtao Xia
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
High reliability leadfree solder alloys for harsh service conditions
- Patent number 11,752,579
- Issue date Sep 12, 2023
- Indium Corporation
- Jie Geng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder paste with mixed solder powders for high temperatu...
- Patent number 11,738,411
- Issue date Aug 29, 2023
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature melting and mid temperature melting lead-free solde...
- Patent number 11,712,762
- Issue date Aug 1, 2023
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder paste as thermal interface material
- Patent number 11,581,239
- Issue date Feb 14, 2023
- Indium Corporation
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 11,413,709
- Issue date Aug 16, 2022
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature melting and mid temperature melting lead-free solde...
- Patent number 11,267,080
- Issue date Mar 8, 2022
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 11,229,979
- Issue date Jan 25, 2022
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid high temperature lead-free solder preform
- Patent number 10,888,958
- Issue date Jan 12, 2021
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preventing post reflow interconnect failures in VIPPO solder joints...
- Patent number 10,813,228
- Issue date Oct 20, 2020
- Indium Corporation
- Lee C. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluxes effective in suppressing non-wet-open at BGA assembly
- Patent number 10,756,039
- Issue date Aug 25, 2020
- Indium Corporation
- Fengying Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid lead-free solder wire
- Patent number 10,328,533
- Issue date Jun 25, 2019
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mixed alloy solder paste
- Patent number 10,118,260
- Issue date Nov 6, 2018
- Indium Corporation
- Hongwen Zhang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Materials having increased mobility after heating
- Patent number 10,010,981
- Issue date Jul 3, 2018
- Indium Corporation
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanomicrocrystallite paste for pressureless sintering
- Patent number 9,875,983
- Issue date Jan 23, 2018
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid lead-free solder wire
- Patent number 9,802,274
- Issue date Oct 31, 2017
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin-indium based low temperature solder alloy
- Patent number 9,741,676
- Issue date Aug 22, 2017
- Indium Corporation
- Jianguo Luo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mixed alloy solder paste
- Patent number 9,636,784
- Issue date May 2, 2017
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloys and solder joints thereof with improved dro...
- Patent number 9,260,768
- Issue date Feb 16, 2016
- Indium Corporation
- Weiping Liu
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Metal coating for indium bump bonding
- Patent number 9,190,377
- Issue date Nov 17, 2015
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MN doped SN-base solder alloy and solder joints thereof with superi...
- Patent number 9,175,368
- Issue date Nov 3, 2015
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating paint with high thermal radiating capability
- Patent number 9,120,930
- Issue date Sep 1, 2015
- Indium Corporation
- Sihai Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Mixed alloy solder paste
- Patent number 9,017,446
- Issue date Apr 28, 2015
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite solder alloy preform
- Patent number 8,348,139
- Issue date Jan 8, 2013
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for increasing the compliance of lead-free solders contai...
- Patent number 7,749,340
- Issue date Jul 6, 2010
- Indium Corporation of America
- Benlih Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for increasing the compliance of tin-indium solders
- Patent number 7,749,336
- Issue date Jul 6, 2010
- Indium Corporation of America
- Benlih Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder pastes for providing high elasticity, low rigidity solder jo...
- Patent number 7,017,795
- Issue date Mar 28, 2006
- Indium Corporation of America
- Yan Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anti-tombstoning solder alloys for surface mount applications
- Patent number 6,783,057
- Issue date Aug 31, 2004
- Indium Corporation of America
- Benlih Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER PASTES AND METHODS OF USING THE SAME
- Publication number 20230241725
- Publication date Aug 3, 2023
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PREPARING GRAPHITE SHEETS WITH PIERCING TREATMENT TO ENH...
- Publication number 20230033918
- Publication date Feb 2, 2023
- Indium Corporation
- Hongtao Xia
- C01 - INORGANIC CHEMISTRY
Information Patent Application
SNIN SOLDER ALLOYS
- Publication number 20220362890
- Publication date Nov 17, 2022
- Indium Corporation
- Francis M. Mutuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20220331913
- Publication date Oct 20, 2022
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE MELTING AND MID TEMPERATURE MELTING LEAD-FREE SOLDE...
- Publication number 20220184749
- Publication date Jun 16, 2022
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER PASTE WITH MIXED SOLDER POWDERS FOR HIGH TEMPERATU...
- Publication number 20210339344
- Publication date Nov 4, 2021
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE MELTING AND MID TEMPERATURE MELTING LEAD-FREE SOLDE...
- Publication number 20200353572
- Publication date Nov 12, 2020
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH RELIABILITY LEADFREE SOLDER ALLOYS FOR HARSH SERVICE CONDITIONS
- Publication number 20200269360
- Publication date Aug 27, 2020
- Indium Corporation
- Jie Geng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER PASTE FOR THERMAL VIA FILLING
- Publication number 20200230750
- Publication date Jul 23, 2020
- Indium Corporation
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER PASTE AS THERMAL INTERFACE MATERIAL
- Publication number 20200235033
- Publication date Jul 23, 2020
- Indium Corporation
- Ning-Cheng Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20200094353
- Publication date Mar 26, 2020
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SNBI AND SNIN SOLDER ALLOYS
- Publication number 20200070287
- Publication date Mar 5, 2020
- Indium Corporation
- Francis M. Mutuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREVENTING POST REFLOW INTERCONNECT FAILURES IN VIPPO SOLDER JOINTS...
- Publication number 20190394883
- Publication date Dec 26, 2019
- Indium Corporation
- Lee C. Kresge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID HIGH TEMPERATURE LEAD-FREE SOLDER PREFORM
- Publication number 20190366486
- Publication date Dec 5, 2019
- Indium Corporation
- HONGWEN ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUXES EFFECTIVE IN SUPPRESSING NON-WET-OPEN AT BGA ASSEMBLY
- Publication number 20190371752
- Publication date Dec 5, 2019
- Indium Corporation
- FENGYING ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LEAD-FREE SOLDER WIRE
- Publication number 20180029170
- Publication date Feb 1, 2018
- Indium Corporation
- HONGWEN ZHANG
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
TIN-INDIUM BASED LOW TEMPERATURE SOLDER ALLOY
- Publication number 20170373034
- Publication date Dec 28, 2017
- Indium Corporation
- Jianguo Luo
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING
- Publication number 20170317046
- Publication date Nov 2, 2017
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LEAD-FREE SOLDER WIRE
- Publication number 20170266765
- Publication date Sep 21, 2017
- Indium Corporation
- HONGWEN ZHANG
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SPACER PARTICLES FOR BOND LINE THICKNESS CONTROL IN SINTERING PASTES
- Publication number 20170271294
- Publication date Sep 21, 2017
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20160325384
- Publication date Nov 10, 2016
- Indium Corporation
- Weiping Liu
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHODS AND COMPOSITIONS FOR FORMING SOLDER BUMPS ON A SUBSTRATE WI...
- Publication number 20150258638
- Publication date Sep 17, 2015
- Indium Corporation
- Ming Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MIXED ALLOY SOLDER PASTE
- Publication number 20150246417
- Publication date Sep 3, 2015
- Indium Corporation
- Hongwen Zhang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MIXED ALLOY SOLDER PASTE
- Publication number 20150224602
- Publication date Aug 13, 2015
- Indium Corporation
- Hongwen Zhang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
HEAT DISSIPATING PAINT WITH HIGH THERMAL RADIATING CAPABILITY
- Publication number 20130112109
- Publication date May 9, 2013
- Indium Corporation
- Sihai Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MN DOPED SN-BASE SOLDER ALLOY AND SOLDER JOINTS THEREOF WITH SUPERI...
- Publication number 20120328361
- Publication date Dec 27, 2012
- Indium Corporation
- WEIPING LIU
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SOLDER PASTES FOR PROVIDING IMPACT RESISTANT, MECHANICALLY STABLE S...
- Publication number 20120248176
- Publication date Oct 4, 2012
- DERRICK Matthew HERRON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL COATING FOR INDIUM BUMP BONDING
- Publication number 20110315429
- Publication date Dec 29, 2011
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOU...
- Publication number 20110273847
- Publication date Nov 10, 2011
- Hong-Sik Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MIXED ALLOY SOLDER PASTE
- Publication number 20110268985
- Publication date Nov 3, 2011
- HONGWEN ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Ning-Cheng Lee

Person

Patents Grantslast 30 patents

High reliability lead-free solder alloys for harsh environment elec...

SnBi and SnIn solder alloys

Method for preparing graphite sheets with piercing treatment to enh...

High reliability leadfree solder alloys for harsh service conditions

Lead-free solder paste with mixed solder powders for high temperatu...

Low temperature melting and mid temperature melting lead-free solde...

Lead-free solder paste as thermal interface material

High reliability lead-free solder alloys for harsh environment elec...

Low temperature melting and mid temperature melting lead-free solde...

High reliability lead-free solder alloys for harsh environment elec...

Hybrid high temperature lead-free solder preform

Preventing post reflow interconnect failures in VIPPO solder joints...

Fluxes effective in suppressing non-wet-open at BGA assembly

Hybrid lead-free solder wire

Mixed alloy solder paste

Materials having increased mobility after heating

Nanomicrocrystallite paste for pressureless sintering

Hybrid lead-free solder wire

Tin-indium based low temperature solder alloy

Mixed alloy solder paste

Lead-free solder alloys and solder joints thereof with improved dro...

Metal coating for indium bump bonding

MN doped SN-base solder alloy and solder joints thereof with superi...

Heat dissipating paint with high thermal radiating capability

Mixed alloy solder paste

Composite solder alloy preform

Technique for increasing the compliance of lead-free solders contai...

Technique for increasing the compliance of tin-indium solders

Solder pastes for providing high elasticity, low rigidity solder jo...

Anti-tombstoning solder alloys for surface mount applications

Patents Applicationslast 30 patents

SOLDER PASTES AND METHODS OF USING THE SAME

METHOD FOR PREPARING GRAPHITE SHEETS WITH PIERCING TREATMENT TO ENH...

SNIN SOLDER ALLOYS

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

LOW TEMPERATURE MELTING AND MID TEMPERATURE MELTING LEAD-FREE SOLDE...

LEAD-FREE SOLDER PASTE WITH MIXED SOLDER POWDERS FOR HIGH TEMPERATU...

LOW TEMPERATURE MELTING AND MID TEMPERATURE MELTING LEAD-FREE SOLDE...

HIGH RELIABILITY LEADFREE SOLDER ALLOYS FOR HARSH SERVICE CONDITIONS

LEAD-FREE SOLDER PASTE FOR THERMAL VIA FILLING

LEAD-FREE SOLDER PASTE AS THERMAL INTERFACE MATERIAL

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

SNBI AND SNIN SOLDER ALLOYS

PREVENTING POST REFLOW INTERCONNECT FAILURES IN VIPPO SOLDER JOINTS...

HYBRID HIGH TEMPERATURE LEAD-FREE SOLDER PREFORM

FLUXES EFFECTIVE IN SUPPRESSING NON-WET-OPEN AT BGA ASSEMBLY

HYBRID LEAD-FREE SOLDER WIRE

TIN-INDIUM BASED LOW TEMPERATURE SOLDER ALLOY

NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING

HYBRID LEAD-FREE SOLDER WIRE

SPACER PARTICLES FOR BOND LINE THICKNESS CONTROL IN SINTERING PASTES

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

METHODS AND COMPOSITIONS FOR FORMING SOLDER BUMPS ON A SUBSTRATE WI...

MIXED ALLOY SOLDER PASTE

MIXED ALLOY SOLDER PASTE

HEAT DISSIPATING PAINT WITH HIGH THERMAL RADIATING CAPABILITY

MN DOPED SN-BASE SOLDER ALLOY AND SOLDER JOINTS THEREOF WITH SUPERI...

SOLDER PASTES FOR PROVIDING IMPACT RESISTANT, MECHANICALLY STABLE S...

METAL COATING FOR INDIUM BUMP BONDING

ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOU...

MIXED ALLOY SOLDER PASTE