Ning Huang

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip package with cooling arrangement
- Patent number 6,567,270
- Issue date May 20, 2003
- Orient Semiconductor Electronics Limited
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for making a metal bump with an increased height
- Patent number 6,499,648
- Issue date Dec 31, 2002
- Orient Semiconductor Electronics Limited
- Wen-Lo Shieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming cylindrical bumps on a substrate for integrated c...
- Patent number 6,390,356
- Issue date May 21, 2002
- Orient Semiconductor Electronics Limited
- Wen Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps on wafers or substrates
- Patent number 6,358,834
- Issue date Mar 19, 2002
- Orient Semiconductor Electronics Limited
- Wen Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of manufacturing thin ball grid array substrates
- Patent number 6,274,491
- Issue date Aug 14, 2001
- Orient Semiconductor Electronics Limited
- Wan Le Xie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package structure for a multi-chip integrated circuit
- Publication number 20040183179
- Publication date Sep 23, 2004
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method for solder bump pattern of rear section wafer pa...
- Publication number 20040082159
- Publication date Apr 29, 2004
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of wire bonding of a semiconductor device for resolving oxid...
- Publication number 20040082174
- Publication date Apr 29, 2004
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Open-type multichips stack packaging
- Publication number 20030160316
- Publication date Aug 28, 2003
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method of semiconductor
- Publication number 20030059721
- Publication date Mar 27, 2003
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package with cooling arrangement
- Publication number 20030035270
- Publication date Feb 20, 2003
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for making a metal bump with an increased height
- Publication number 20030006268
- Publication date Jan 9, 2003
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR MAKING A METAL BUMP WITH AN INCREASED HEIGHT
- Publication number 20020179686
- Publication date Dec 5, 2002
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for multilayer high density substrate
- Publication number 20020072216
- Publication date Jun 13, 2002
- Wen Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor chip package with cooling arrangement

Method and device for making a metal bump with an increased height

Method of forming cylindrical bumps on a substrate for integrated c...

Method of forming bumps on wafers or substrates

Process of manufacturing thin ball grid array substrates

Patents Applicationslast 30 patents

Package structure for a multi-chip integrated circuit

Fabrication method for solder bump pattern of rear section wafer pa...

Method of wire bonding of a semiconductor device for resolving oxid...

Open-type multichips stack packaging

Fabrication method of semiconductor

Semiconductor chip package with cooling arrangement

Method and device for making a metal bump with an increased height

METHOD AND DEVICE FOR MAKING A METAL BUMP WITH AN INCREASED HEIGHT

Manufacturing method for multilayer high density substrate