Niranjan PINGLE

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Milpitas, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Modular mainframe layout for supporting multiple semiconductor proc...
- Patent number 11,935,771
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Randy A. Harris
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated process sequence for hybrid bonding applications
- Publication number 20240194635
- Publication date Jun 13, 2024
- Niranjan PINGLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROC...
- Publication number 20240194503
- Publication date Jun 13, 2024
- Applied Materials, Inc.
- Randy A. HARRIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROC...
- Publication number 20220262653
- Publication date Aug 18, 2022
- Randy A. HARRIS
- H01 - BASIC ELECTRIC ELEMENTS