Nirdesh Ojha

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Patents Grantslast 30 patents

Information Patent Grant
Slicing SiC material by wire electrical discharge machining
- Patent number 10,967,450
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Nirdesh Ojha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of thinning and structuring semiconductor wafers by electri...
- Patent number 10,643,860
- Issue date May 5, 2020
- Infineon Technologies AG
- Nirdesh Ojha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Edge Shaping of Substrates
- Publication number 20200343085
- Publication date Oct 29, 2020
- INFINEON TECHNOLOGIES AG
- Nirdesh Ojha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Slicing SiC Material by Wire Electrical Discharge Machining
- Publication number 20190337069
- Publication date Nov 7, 2019
- INFINEON TECHNOLOGIES AG
- Nirdesh Ojha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of Thinning and Structuring Semiconductor Wafers by Electri...
- Publication number 20190295855
- Publication date Sep 26, 2019
- INFINEON TECHNOLOGIES AG
- Nirdesh Ojha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR