Nirmal K. Sharma

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Fremont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Package for integrated circuit with thermal vias and method thereof
- Patent number 6,861,283
- Issue date Mar 1, 2005
- Intersil Corporation
- Nirmal K. Sharma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package for integrated circuit with thermal vias and method thereof
- Patent number 6,809,416
- Issue date Oct 26, 2004
- Intersil Corporation
- Nirmal K. Sharma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Matched impedance bonding technique in high-speed integrated circuits
- Patent number 6,646,343
- Issue date Nov 11, 2003
- BitBlitz Communications, Inc.
- Nirmal Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe based chip scale package and method of producing the same
- Patent number 6,420,779
- Issue date Jul 16, 2002
- ST Assembly Test Services Ltd.
- Nirmal K. Sharma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package for integrated circuit with thermal vias and method thereof
- Publication number 20040097015
- Publication date May 20, 2004
- Nirmal K. Sharma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR