Nirup Bandaru

Follow

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated assemblies which include stacked memory decks, and metho...
- Patent number 12,010,850
- Issue date Jun 11, 2024
- John D. Hopkins
Information Patent Grant
Integrated assemblies which include stacked memory decks
- Patent number 11,744,072
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- John D. Hopkins
Information Patent Grant
Methods of forming integrated assemblies include stacked memory decks
- Patent number 11,107,831
- Issue date Aug 31, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED ASSEMBLIES WHICH INCLUDE STACKED MEMORY DECKS, AND METHO...
- Publication number 20240397717
- Publication date Nov 28, 2024
- Lodestar Licensing Group LLC
- John D. Hopkins
Information Patent Application
Integrated Assemblies Which Include Stacked Memory Decks, and Metho...
- Publication number 20240008275
- Publication date Jan 4, 2024
- Lodestar Licensing Group LLC
- John D. Hopkins
Information Patent Application
Integrated Assemblies Which Include Stacked Memory Decks, and Metho...
- Publication number 20210358951
- Publication date Nov 18, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Which Include Stacked Memory Decks, and Metho...
- Publication number 20210167081
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS