Nisha Ananthakrishnan

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level passive heat spreader interposer to enable improved the...
- Patent number 11,804,470
- Issue date Oct 31, 2023
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
- Patent number 11,776,821
- Issue date Oct 3, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
- Patent number 11,282,717
- Issue date Mar 22, 2022
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two material high K thermal encapsulant system
- Patent number 10,475,715
- Issue date Nov 12, 2019
- Intel Corporation
- Venmathy McMahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
- Patent number 10,115,606
- Issue date Oct 30, 2018
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold compound with reinforced fibers
- Patent number 9,704,767
- Issue date Jul 11, 2017
- Intel Corporation
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust ink formulations for durable markings on microelectronic pac...
- Patent number 9,640,415
- Issue date May 2, 2017
- Intel Corporation
- Randall D. Lowe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wafer level underfill materials and structures f...
- Patent number 9,631,065
- Issue date Apr 25, 2017
- Intel Corporation
- Anna M. Prakash
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,611,372
- Issue date Apr 4, 2017
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxing-encapsulant material for microelectronic packages assembled...
- Patent number 9,504,168
- Issue date Nov 22, 2016
- Intel Corporation
- Sivakumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible underfill compositions for enhanced reliability
- Patent number 9,458,283
- Issue date Oct 4, 2016
- Intel Corporation
- Dingying Xu
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Method for reducing underfill filler settling in integrated circuit...
- Patent number 9,431,274
- Issue date Aug 30, 2016
- Intel Corporation
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
- Patent number 9,330,993
- Issue date May 3, 2016
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Narrow-gap flip chip underfill composition
- Patent number 9,269,596
- Issue date Feb 23, 2016
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible underfill compositions for enhanced reliability
- Patent number 9,068,067
- Issue date Jun 30, 2015
- Intel Corporation
- Dingying Xu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy-amine underfill materials for semiconductor packages
- Patent number 8,916,981
- Issue date Dec 23, 2014
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust ink formulations for durable markings on microelectronic pac...
- Patent number 8,900,919
- Issue date Dec 2, 2014
- Intel Corporation
- Randall D. Lowe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Techniques and configurations for surface treatment of an integrate...
- Patent number 8,895,365
- Issue date Nov 25, 2014
- Intel Corporation
- Suriyakala Ramalingam
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microelectronic package with wear resistant coating
- Patent number 7,759,780
- Issue date Jul 20, 2010
- Intel Corporation
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240128152
- Publication date Apr 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240021493
- Publication date Jan 18, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20240014097
- Publication date Jan 11, 2024
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...
- Publication number 20220165585
- Publication date May 26, 2022
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL FOR INTEGRATED CIRCUIT (IC) PACKAGE
- Publication number 20210242102
- Publication date Aug 5, 2021
- Intel Corporation
- Elizabeth NOFEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...
- Publication number 20210066155
- Publication date Mar 4, 2021
- Intel Corporation
- Elizabeth NOFEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PASSIVE HEAT SPREADER INTERPOSER TO ENABLE IMPROVED THE...
- Publication number 20210057381
- Publication date Feb 25, 2021
- Intel Corporation
- Xavier F. BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN LINE DAM ON UNDERFILL MATERIAL TO CONTAIN THERMAL INTERFACE MA...
- Publication number 20200126887
- Publication date Apr 23, 2020
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...
- Publication number 20190304808
- Publication date Oct 3, 2019
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME
- Publication number 20190099777
- Publication date Apr 4, 2019
- Intel Corporation
- Ken P. Hackenberg
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME
- Publication number 20190099776
- Publication date Apr 4, 2019
- Ken P. Hackenberg
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE
- Publication number 20180286704
- Publication date Oct 4, 2018
- Intel Corporation
- Elizabeth M. Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold compound with reinforced fibers
- Publication number 20170186658
- Publication date Jun 29, 2017
- Intel Corporation
- Suriyakala RAMALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO MATERIAL HIGH K THERMAL ENCAPSULANT SYSTEM
- Publication number 20170170088
- Publication date Jun 15, 2017
- Intel Corporation
- Venmathy McMahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...
- Publication number 20170042043
- Publication date Feb 9, 2017
- SIVAKUMAR NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20160343591
- Publication date Nov 24, 2016
- Intel Corporation
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...
- Publication number 20160240395
- Publication date Aug 18, 2016
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION
- Publication number 20160168351
- Publication date Jun 16, 2016
- Intel Corporation
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY
- Publication number 20150284503
- Publication date Oct 8, 2015
- Intel Corporation
- Dingying XU
- C07 - ORGANIC CHEMISTRY
Information Patent Application
NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION
- Publication number 20150179478
- Publication date Jun 25, 2015
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PAC...
- Publication number 20150166804
- Publication date Jun 18, 2015
- Intel Corporation
- Randall D. Lowe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EPOXY-AMINE UNDERFILL MATERIALS FOR SEMICONDUCTOR PACKAGES
- Publication number 20140332966
- Publication date Nov 13, 2014
- Yonghao Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WAFER LEVEL UNDERFILL MATERIALS AND STRUCTURES F...
- Publication number 20140264827
- Publication date Sep 18, 2014
- Anna M. Prakash
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PAC...
- Publication number 20140264957
- Publication date Sep 18, 2014
- Randall D. Lowe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20140177149
- Publication date Jun 26, 2014
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...
- Publication number 20140175634
- Publication date Jun 26, 2014
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS FOR SURFACE TREATMENT OF AN INTEGRATE...
- Publication number 20140061902
- Publication date Mar 6, 2014
- Suriyakala Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...
- Publication number 20130263446
- Publication date Oct 10, 2013
- Intel Corporation
- Sivakumar Nagarajan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY
- Publication number 20120074597
- Publication date Mar 29, 2012
- Dingying Xu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MICROELECTRONIC PACKAGE WITH WEAR RESISTANT COATING
- Publication number 20100078806
- Publication date Apr 1, 2010
- Nirupama Chakrapani
- H01 - BASIC ELECTRIC ELEMENTS

Nisha Ananthakrishnan

Person

Patents Grantslast 30 patents

Wafer level passive heat spreader interposer to enable improved the...

Micro-electronic package with substrate protrusion to facilitate di...

Micro-electronic package with substrate protrusion to facilitate di...

Two material high K thermal encapsulant system

Methods of promoting adhesion between underfill and conductive bump...

Mold compound with reinforced fibers

Robust ink formulations for durable markings on microelectronic pac...

Methods of forming wafer level underfill materials and structures f...

Narrow-gap flip chip underfill composition

Fluxing-encapsulant material for microelectronic packages assembled...

Flexible underfill compositions for enhanced reliability

Method for reducing underfill filler settling in integrated circuit...

Methods of promoting adhesion between underfill and conductive bump...

Narrow-gap flip chip underfill composition

Flexible underfill compositions for enhanced reliability

Epoxy-amine underfill materials for semiconductor packages

Robust ink formulations for durable markings on microelectronic pac...

Techniques and configurations for surface treatment of an integrate...

Microelectronic package with wear resistant coating

Patents Applicationslast 30 patents

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...

UNDERFILL MATERIAL FOR INTEGRATED CIRCUIT (IC) PACKAGE

MICROELECTRONICS PACKAGE COMPRISING A PACKAGE-ON-PACKAGE (POP) ARCH...

WAFER LEVEL PASSIVE HEAT SPREADER INTERPOSER TO ENABLE IMPROVED THE...

THIN LINE DAM ON UNDERFILL MATERIAL TO CONTAIN THERMAL INTERFACE MA...

MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...

COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME

COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME

PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE

Mold compound with reinforced fibers

TWO MATERIAL HIGH K THERMAL ENCAPSULANT SYSTEM

FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...

REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES

METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...

NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION

FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY

NARROW-GAP FLIP CHIP UNDERFILL COMPOSITION

ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PAC...

EPOXY-AMINE UNDERFILL MATERIALS FOR SEMICONDUCTOR PACKAGES

METHODS OF FORMING WAFER LEVEL UNDERFILL MATERIALS AND STRUCTURES F...

ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PAC...

REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES

METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...

TECHNIQUES AND CONFIGURATIONS FOR SURFACE TREATMENT OF AN INTEGRATE...

FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED...

FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY

MICROELECTRONIC PACKAGE WITH WEAR RESISTANT COATING