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Nishimura Tetsuro

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Patents Grantslast 30 patents

  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 12,172,242
    • Issue date Dec 24, 2024
    • Nihon Superior Co., Ltd.
    • Takatoshi Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder joint part and method for manufacturing the same
    • Patent number 11,980,974
    • Issue date May 14, 2024
    • Nihon Superior Co., Ltd.
    • Kazuhiro Nogita
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy and solder joint part
    • Patent number 11,839,937
    • Issue date Dec 12, 2023
    • Nihon Superior Co., Ltd.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Nanoparticle production method, production device and automatic pro...
    • Patent number 10,427,220
    • Issue date Oct 1, 2019
    • APPLIED NANOPARTICLE LABORATORY CORPORATION
    • Teruo Komatsu
    • B22 - CASTING POWDER METALLURGY
  • Information Patent Grant

    Solder alloy and joint thereof
    • Patent number 10,329,642
    • Issue date Jun 25, 2019
    • Nihon Superior Co., Ltd.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 10,286,497
    • Issue date May 14, 2019
    • Nihon Superior Co., Ltd.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder wire bobbinless coil
    • Patent number 9,999,936
    • Issue date Jun 19, 2018
    • Nihon Superior Co., Ltd.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy
    • Patent number 9,999,945
    • Issue date Jun 19, 2018
    • Nihon Superior Co., Ltd.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 9,339,893
    • Issue date May 17, 2016
    • Nihon Superior Co., Ltd.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder joint
    • Patent number 8,999,519
    • Issue date Apr 7, 2015
    • Nihon Superior Sha Co., Ltd.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Flux composition and soldering paste composition
    • Patent number 8,652,269
    • Issue date Feb 18, 2014
    • Nihon Superior Co., Ltd.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of regulating nickel concentration in lead-free solder conta...
    • Patent number 8,557,021
    • Issue date Oct 15, 2013
    • Nihon Superior Sha Co., Ltd.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of copper precipitation in lead-free solder, granulation and...
    • Patent number 8,163,061
    • Issue date Apr 24, 2012
    • Nihon Superior Sha Co., Ltd.
    • Tetsuro Nishimura
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Apparatus for precipitation/separation of excess copper in lead-fre...
    • Patent number 8,147,746
    • Issue date Apr 3, 2012
    • Nihon Superior Sha Co., Ltd.
    • Tetsuro Nishimura
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Replenished lead-free solder and a control method for copper densit...
    • Patent number 7,861,909
    • Issue date Jan 4, 2011
    • Nihon Superior Sha Co., Ltd.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of copper precipitation in lead-free solder, granulation and...
    • Patent number 7,591,873
    • Issue date Sep 22, 2009
    • Nihon Superior Sha Co., Ltd.
    • Tetsuro Nishimura
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Control method for copper density in a solder dipping bath
    • Patent number 6,699,306
    • Issue date Mar 2, 2004
    • Nihon Superior Sha Co., Ltd.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 6,296,722
    • Issue date Oct 2, 2001
    • Nihon Superior Sha Co., Ltd.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 6,180,055
    • Issue date Jan 30, 2001
    • Nihon Superior Sha Co., Ltd.
    • Nishimura Tetsuro
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wave soldering machine
    • Patent number 5,772,101
    • Issue date Jun 30, 1998
    • NS Tekuno Co., Ltd.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Tin based solder alloy containing lead, antimony, and tellurium
    • Patent number 5,487,868
    • Issue date Jan 30, 1996
    • Nihon Superior Co., Ltd.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Soldering flux
    • Patent number 5,417,771
    • Issue date May 23, 1995
    • Takeda Chemical Industries, Ltd.
    • Kazuhiro Arita
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    LEAD-FREE SOLDER PASTE
    • Publication number 20240238915
    • Publication date Jul 18, 2024
    • NIHON SUPERIOR CO., LTD.
    • Tetsuro NISHIMURA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER PASTE AND SOLDER BONDED BODY
    • Publication number 20220297243
    • Publication date Sep 22, 2022
    • NIHON SUPERIOR CO., LTD.
    • Tetsuro NISHIMURA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER-METAL MESH COMPOSITE MATERIAL AND METHOD FOR PRODUCING SAME
    • Publication number 20220281035
    • Publication date Sep 8, 2022
    • NIHON SUPERIOR CO., LTD.
    • Tetsuro NISHIMURA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PREFORMED SOLDER AND SOLDER BONDED BODY FORMED BY USING SAID PREFOR...
    • Publication number 20220274212
    • Publication date Sep 1, 2022
    • NIHON SUPERIOR CO., LTD.
    • Tetsuro NISHIMURA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEAD-FREE SOLDER ALLOY
    • Publication number 20220105593
    • Publication date Apr 7, 2022
    • NIHON SUPERIOR CO., LTD.
    • Takatoshi NISHIMURA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEAD-FREE SOLDER ALLOY AND SOLDER JOINT PART
    • Publication number 20220016733
    • Publication date Jan 20, 2022
    • NIHON SUPERIOR CO., LTD.
    • Tetsuro NISHIMURA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER JOINT PART AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20220009040
    • Publication date Jan 13, 2022
    • NIHON SUPERIOR CO., LTD.
    • Kazuhiro NOGITA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Soldered Joint
    • Publication number 20200140975
    • Publication date May 7, 2020
    • NIHON SUPERIOR CO., LTD.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER WIRE BOBBINLESS COIL
    • Publication number 20160375517
    • Publication date Dec 29, 2016
    • NIHON SUPERIOR CO., LTD.
    • Tetsuro NISHIMURA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEAD-FREE SOLDER ALLOY
    • Publication number 20160368102
    • Publication date Dec 22, 2016
    • NIHON SUPERIOR CO., LTD.
    • Tetsuro NISHIMURA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    SOLDER ALLOY AND JOINT THEREOF
    • Publication number 20160032424
    • Publication date Feb 4, 2016
    • NIHON SUPERIOR CO., LTD.
    • Tetsuro NISHIMURA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    WIRE SOLDER, METHOD OF FEEDING THE SAME, AND APPARATUS AND SYSTEM T...
    • Publication number 20140224861
    • Publication date Aug 14, 2014
    • NIHON SUPERIOR CO., LTD.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LEAD-FREE SOLDER ALLOY
    • Publication number 20140037369
    • Publication date Feb 6, 2014
    • NIHON SUPERIOR CO., LTD.
    • Tetsuro Nishimura
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    SOLDER ALLOY
    • Publication number 20140030140
    • Publication date Jan 30, 2014
    • THE UNIVERSITY OF QUEENSLAND
    • Tetsuro Nishimura
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR
    • Publication number 20120286026
    • Publication date Nov 15, 2012
    • NIHON SUPERIOR CO., LTD.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR
    • Publication number 20120280020
    • Publication date Nov 8, 2012
    • NIHON SUPERIOR CO., LTD.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR
    • Publication number 20110272454
    • Publication date Nov 10, 2011
    • NIHON SUPERIOR CO., LTD.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLUX COMPOSITION AND SOLDERING PASTE COMPOSITION
    • Publication number 20110220247
    • Publication date Sep 15, 2011
    • NIHON SUPERIOR CO., LTD.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF REGULATING NICKEL CONCENTRATION IN LEAD-FREE SOLDER CONTA...
    • Publication number 20100307292
    • Publication date Dec 9, 2010
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER JOINT
    • Publication number 20100266870
    • Publication date Oct 21, 2010
    • NIHON SUPERIOR SHA CO., LTD.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    APPARATUS FOR PRECIPITATION/SEPARATION OF EXCESS COPPER IN LEAD-FRE...
    • Publication number 20100007068
    • Publication date Jan 14, 2010
    • Tetsuro Nishimura
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATIN...
    • Publication number 20090289102
    • Publication date Nov 26, 2009
    • NIHON SUPERIOR SHA CO., LTD.
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF COPPER PRECIPITATION IN LEAD-FREE SOLDER, GRANULATION AND...
    • Publication number 20090277302
    • Publication date Nov 12, 2009
    • Nihon Superior Sha Co., Ltd.
    • Tetsuro Nishimura
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Method of Depositing Copper in Lead-Free Solder, Method of Granulat...
    • Publication number 20080216605
    • Publication date Sep 11, 2008
    • NIHON SUPERIOR SHA CO., LTD.
    • Tetsuro Nishimura
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    A control method for copper density in a solder dipping bath
    • Publication number 20020134200
    • Publication date Sep 26, 2002
    • Tetsuro Nishimura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR