Nitesh Kumbhat

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board with cavity
- Patent number 10,827,617
- Issue date Nov 3, 2020
- Avago Technologies International Sales Pte. Limited
- Dingyou Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module with embedded side shield structures and method of fabricati...
- Patent number 10,163,808
- Issue date Dec 25, 2018
- Avago Technologies International Sales Pte. Limited
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit package with segmented external shield to provide internal...
- Patent number 10,134,682
- Issue date Nov 20, 2018
- Avago Technologies International Sales Pte. Limited
- Nitesh Kumbhat
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Module with internal wire fence shielding
- Patent number 10,021,790
- Issue date Jul 10, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Jin Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module with external shield and back-spill barrier for protecting c...
- Patent number 9,974,181
- Issue date May 15, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sarah Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board (PCB) and PCB assembly having an encapsulatin...
- Patent number 9,907,169
- Issue date Feb 27, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20240074066
- Publication date Feb 29, 2024
- Apple Inc.
- Nitesh KUMBHAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH CAVITY
- Publication number 20200245465
- Publication date Jul 30, 2020
- Avago Technologies International Sales Pte. Limited
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD (PCB) AND PCB ASSEMBLY HAVING AN ENCAPSULATIN...
- Publication number 20180063951
- Publication date Mar 1, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE WITH EXTERNAL SHIELD AND BACK-SPILL BARRIER FOR PROTECTING C...
- Publication number 20170280561
- Publication date Sep 28, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Sarah Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH INTERNAL WIRE FENCE SHIELDING
- Publication number 20170251576
- Publication date Aug 31, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Jin Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING SOLDER BUMPS ON SOLID STATE MODULE INCLUDING PRIN...
- Publication number 20170213785
- Publication date Jul 27, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Nitesh Kumbhat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGE WITH TRENCH FEATURES TO PROVIDE INTERNAL SHIELDING...
- Publication number 20170117229
- Publication date Apr 27, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Nitesh Kumbhat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGE WITH BOND WIRES TO PROVIDE INTERNAL SHIELDING BETWE...
- Publication number 20170118877
- Publication date Apr 27, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT PACKAGE WITH SEGMENTED EXTERNAL SHIELD TO PROVIDE INTERNAL...
- Publication number 20170117230
- Publication date Apr 27, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Nitesh Kumbhat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH EMBEDDED SIDE SHIELD STRUCTURES AND METHOD OF FABRICATI...
- Publication number 20170118875
- Publication date Apr 27, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Nitesh Kumbhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP MODULE
- Publication number 20170062352
- Publication date Mar 2, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Deog-Soon Choi
- H01 - BASIC ELECTRIC ELEMENTS

Nitesh Kumbhat

Person

Patents Grantslast 30 patents

Printed circuit board with cavity

Module with embedded side shield structures and method of fabricati...

Circuit package with segmented external shield to provide internal...

Module with internal wire fence shielding

Module with external shield and back-spill barrier for protecting c...

Printed circuit board (PCB) and PCB assembly having an encapsulatin...

Patents Applicationslast 30 patents

TRANSFER MOLDING SYSTEMS FOR SEMICONDUCTOR DEVICE PACKAGING

PRINTED CIRCUIT BOARD WITH CAVITY

PRINTED CIRCUIT BOARD (PCB) AND PCB ASSEMBLY HAVING AN ENCAPSULATIN...

MODULE WITH EXTERNAL SHIELD AND BACK-SPILL BARRIER FOR PROTECTING C...

MODULE WITH INTERNAL WIRE FENCE SHIELDING

METHOD OF FORMING SOLDER BUMPS ON SOLID STATE MODULE INCLUDING PRIN...

CIRCUIT PACKAGE WITH TRENCH FEATURES TO PROVIDE INTERNAL SHIELDING...

CIRCUIT PACKAGE WITH BOND WIRES TO PROVIDE INTERNAL SHIELDING BETWE...

CIRCUIT PACKAGE WITH SEGMENTED EXTERNAL SHIELD TO PROVIDE INTERNAL...

MODULE WITH EMBEDDED SIDE SHIELD STRUCTURES AND METHOD OF FABRICATI...

SEMICONDUCTOR CHIP MODULE