Nitin A. Deshpande Jr.

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Enabling passive alignment for lens attach
- Patent number 12,353,032
- Issue date Jul 8, 2025
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Grant
Microelectronic package with substrate cavity for bridge-attach
- Patent number 12,272,650
- Issue date Apr 8, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 12,243,792
- Issue date Mar 4, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated circuit packaging architecture
- Patent number 12,181,710
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- G02 - OPTICS
Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open cavity bridge co-planar placement architectures and processes
- Patent number 12,176,268
- Issue date Dec 24, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package expanded beam connector for on-package optics
- Patent number 12,174,436
- Issue date Dec 24, 2024
- Intel Corporation
- Wesley Morgan
- G02 - OPTICS
Information Patent Grant
Active bridge enabled co-packaged photonic transceiver
- Patent number 12,148,742
- Issue date Nov 19, 2024
- Intel Corporation
- Thomas Liljeberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 12,113,023
- Issue date Oct 8, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch on interposer architecture for low cost optical co-packaging
- Patent number 12,061,371
- Issue date Aug 13, 2024
- Intel Corporation
- Xiaoqian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon groove architectures and manufacturing processes for passiv...
- Patent number 12,044,888
- Issue date Jul 23, 2024
- Intel Corporation
- Omkar Karhade
- G02 - OPTICS
Information Patent Grant
Open cavity bridge power delivery architectures and processes
- Patent number 12,027,448
- Issue date Jul 2, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,923,307
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,887,962
- Issue date Jan 30, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material flow control for reduced die-to-die spacing in s...
- Patent number 11,854,945
- Issue date Dec 26, 2023
- Tahoe Research, LTD.
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,804,441
- Issue date Oct 31, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip semiconductor package including a bridge die disposed in...
- Patent number 11,791,274
- Issue date Oct 17, 2023
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,764,080
- Issue date Sep 19, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,735,558
- Issue date Aug 22, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly that includes a bridge
- Patent number 11,676,900
- Issue date Jun 13, 2023
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled cooling fins in ultra-small systems
- Patent number 11,574,851
- Issue date Feb 7, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,545,407
- Issue date Jan 3, 2023
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,521,931
- Issue date Dec 6, 2022
- Intel Corporation
- Jason M. Gamba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna boards and communication devices
- Patent number 11,522,291
- Issue date Dec 6, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,373,972
- Issue date Jun 28, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,328,937
- Issue date May 10, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold material architecture for package device structures
- Patent number 11,254,563
- Issue date Feb 22, 2022
- Intel Corporation
- Omkar G. Karhade
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermally coupled package-on-package semiconductor packages
- Patent number 11,222,877
- Issue date Jan 11, 2022
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control for microelectronics packages
- Patent number 11,114,388
- Issue date Sep 7, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package thermal transfer systems and methods
- Patent number 11,056,466
- Issue date Jul 6, 2021
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20250167062
- Publication date May 22, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-DIE INPUT/OUTPUT SIGNAL ROUTING UTILIZING OPPOSING DIE SURFA...
- Publication number 20250112205
- Publication date Apr 3, 2025
- Intel Corporation
- Prashant Majhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS
- Publication number 20250112168
- Publication date Apr 3, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH DOUBLE HYBRID BONDED DIES AND METH...
- Publication number 20250105207
- Publication date Mar 27, 2025
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY LAYERS AT OPPOSING SIDES OF A COMPLEMENTARY METAL-OXIDE SEMI...
- Publication number 20250098179
- Publication date Mar 20, 2025
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20250096009
- Publication date Mar 20, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AND VOLTAGE RE...
- Publication number 20250079398
- Publication date Mar 6, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH A COOLING...
- Publication number 20250079263
- Publication date Mar 6, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING INTERCONNECT (HBI) ARCHITECTURES AND METHODS FOR SCA...
- Publication number 20250079392
- Publication date Mar 6, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AS A SOLID STA...
- Publication number 20250079399
- Publication date Mar 6, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURE
- Publication number 20250060531
- Publication date Feb 20, 2025
- Intel Corporation
- Omkar G. Karhade
- G02 - OPTICS
Information Patent Application
PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH SOLDER IN...
- Publication number 20250062278
- Publication date Feb 20, 2025
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLIT FIDUCIALS FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT
- Publication number 20250006651
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUI...
- Publication number 20250006652
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES
- Publication number 20250006653
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCAL...
- Publication number 20250006695
- Publication date Jan 2, 2025
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY STACKS INCLUDING REPLACEMENT BLOCKS AND RELATED METHODS
- Publication number 20240357839
- Publication date Oct 24, 2024
- Nitin Ashok Deshpande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240347590
- Publication date Oct 17, 2024
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN
- Publication number 20240319437
- Publication date Sep 26, 2024
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC IN...
- Publication number 20240272388
- Publication date Aug 15, 2024
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20240136292
- Publication date Apr 25, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF...
- Publication number 20240113088
- Publication date Apr 4, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF SCALABLE COMPUTE WALL HAVING COMPUTE BRICK...
- Publication number 20240006395
- Publication date Jan 4, 2024
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIAL MARKS FOR VERIFYING ALIGNMENT ACCURACY OF BONDED INTEGRATE...
- Publication number 20240006332
- Publication date Jan 4, 2024
- Intel Corporation
- Dimitrios Antartis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH COMPUTE BRICKS HAVING VERTICALLY STACKED...
- Publication number 20240006375
- Publication date Jan 4, 2024
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH IN...
- Publication number 20230420411
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIE...
- Publication number 20230420432
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20230420376
- Publication date Dec 28, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT D...
- Publication number 20230420436
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT D...
- Publication number 20230420409
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS

Nitin A. Deshpande Jr.

Person

Patents Grantslast 30 patents

Enabling passive alignment for lens attach

Microelectronic package with substrate cavity for bridge-attach

Microelectronic structures including bridges

Photonic integrated circuit packaging architecture

Low cost package warpage solution

Open cavity bridge co-planar placement architectures and processes

Package expanded beam connector for on-package optics

Active bridge enabled co-packaged photonic transceiver

Microelectronic structures including bridges

Patch on interposer architecture for low cost optical co-packaging

Silicon groove architectures and manufacturing processes for passiv...

Open cavity bridge power delivery architectures and processes

Microelectronic structures including bridges

Microelectronic structures including bridges

Underfill material flow control for reduced die-to-die spacing in s...

Microelectronic structures including bridges

Multichip semiconductor package including a bridge die disposed in...

Low cost package warpage solution

Microelectronic structures including bridges

Electronic assembly that includes a bridge

Coupled cooling fins in ultra-small systems

Thermal management solutions for integrated circuit packages

Microelectronic structures including bridges

Antenna boards and communication devices

Microelectronic structures including bridges

Low cost package warpage solution

Mold material architecture for package device structures

Thermally coupled package-on-package semiconductor packages

Warpage control for microelectronics packages

Package on package thermal transfer systems and methods

Patents Applicationslast 30 patents

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

DIE-TO-DIE INPUT/OUTPUT SIGNAL ROUTING UTILIZING OPPOSING DIE SURFA...

HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS

INTEGRATED CIRCUIT PACKAGES WITH DOUBLE HYBRID BONDED DIES AND METH...

MEMORY LAYERS AT OPPOSING SIDES OF A COMPLEMENTARY METAL-OXIDE SEMI...

LOW COST PACKAGE WARPAGE SOLUTION

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AND VOLTAGE RE...

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH A COOLING...

HYBRID BONDING INTERCONNECT (HBI) ARCHITECTURES AND METHODS FOR SCA...

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AS A SOLID STA...

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURE

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH SOLDER IN...

SLIT FIDUCIALS FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT

FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUI...

FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES

PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCAL...

MEMORY STACKS INCLUDING REPLACEMENT BLOCKS AND RELATED METHODS

METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES

PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN

ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC IN...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF...

PACKAGE ARCHITECTURE OF SCALABLE COMPUTE WALL HAVING COMPUTE BRICK...

FIDUCIAL MARKS FOR VERIFYING ALIGNMENT ACCURACY OF BONDED INTEGRATE...

PACKAGE ARCHITECTURE WITH COMPUTE BRICKS HAVING VERTICALLY STACKED...

PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH IN...

PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIE...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT D...

PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT D...