Nitin A. Deshpande Jr.

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic structures including bridges
- Patent number 12,113,023
- Issue date Oct 8, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch on interposer architecture for low cost optical co-packaging
- Patent number 12,061,371
- Issue date Aug 13, 2024
- Intel Corporation
- Xiaoqian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon groove architectures and manufacturing processes for passiv...
- Patent number 12,044,888
- Issue date Jul 23, 2024
- Intel Corporation
- Omkar Karhade
- G02 - OPTICS
Information Patent Grant
Open cavity bridge power delivery architectures and processes
- Patent number 12,027,448
- Issue date Jul 2, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,923,307
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,887,962
- Issue date Jan 30, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material flow control for reduced die-to-die spacing in s...
- Patent number 11,854,945
- Issue date Dec 26, 2023
- Tahoe Research, LTD.
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,804,441
- Issue date Oct 31, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip semiconductor package including a bridge die disposed in...
- Patent number 11,791,274
- Issue date Oct 17, 2023
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,764,080
- Issue date Sep 19, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,735,558
- Issue date Aug 22, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly that includes a bridge
- Patent number 11,676,900
- Issue date Jun 13, 2023
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled cooling fins in ultra-small systems
- Patent number 11,574,851
- Issue date Feb 7, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,545,407
- Issue date Jan 3, 2023
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,521,931
- Issue date Dec 6, 2022
- Intel Corporation
- Jason M. Gamba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna boards and communication devices
- Patent number 11,522,291
- Issue date Dec 6, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,373,972
- Issue date Jun 28, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,328,937
- Issue date May 10, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold material architecture for package device structures
- Patent number 11,254,563
- Issue date Feb 22, 2022
- Intel Corporation
- Omkar G. Karhade
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermally coupled package-on-package semiconductor packages
- Patent number 11,222,877
- Issue date Jan 11, 2022
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control for microelectronics packages
- Patent number 11,114,388
- Issue date Sep 7, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package thermal transfer systems and methods
- Patent number 11,056,466
- Issue date Jul 6, 2021
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-device bridge with through-bridge conductive via sig...
- Patent number 10,797,000
- Issue date Oct 6, 2020
- Intel Corporation
- Nitin A. Deshpande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 10,741,419
- Issue date Aug 11, 2020
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and materials for warpage thermal and interconnect solutions
- Patent number 10,672,626
- Issue date Jun 2, 2020
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-magnetic interference (EMI) shielding techniques and config...
- Patent number 10,595,409
- Issue date Mar 17, 2020
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package thermal transfer systems and methods
- Patent number 10,438,930
- Issue date Oct 8, 2019
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 10,403,512
- Issue date Sep 3, 2019
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control for microelectronics packages
- Patent number 10,256,198
- Issue date Apr 9, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded multi-device bridge with through-bridge conductive via sig...
- Patent number 10,229,882
- Issue date Mar 12, 2019
- Intel Corporation
- Nitin A. Deshpande
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY STACKS INCLUDING REPLACEMENT BLOCKS AND RELATED METHODS
- Publication number 20240357839
- Publication date Oct 24, 2024
- Nitin Ashok Deshpande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240347590
- Publication date Oct 17, 2024
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN
- Publication number 20240319437
- Publication date Sep 26, 2024
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC IN...
- Publication number 20240272388
- Publication date Aug 15, 2024
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20240136292
- Publication date Apr 25, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF...
- Publication number 20240113088
- Publication date Apr 4, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF SCALABLE COMPUTE WALL HAVING COMPUTE BRICK...
- Publication number 20240006395
- Publication date Jan 4, 2024
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIAL MARKS FOR VERIFYING ALIGNMENT ACCURACY OF BONDED INTEGRATE...
- Publication number 20240006332
- Publication date Jan 4, 2024
- Intel Corporation
- Dimitrios Antartis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH COMPUTE BRICKS HAVING VERTICALLY STACKED...
- Publication number 20240006375
- Publication date Jan 4, 2024
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH IN...
- Publication number 20230420411
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIE...
- Publication number 20230420432
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20230420376
- Publication date Dec 28, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT D...
- Publication number 20230420436
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT D...
- Publication number 20230420409
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLA...
- Publication number 20230420410
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNI...
- Publication number 20230387074
- Publication date Nov 30, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20230369071
- Publication date Nov 16, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD...
- Publication number 20230343769
- Publication date Oct 26, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVERED CAVITY FOR A PHOTONIC INTEGRATED CIRCUIT (PIC)
- Publication number 20230341622
- Publication date Oct 26, 2023
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
RIBBON SHIELD DEVICE AND METHOD
- Publication number 20230317680
- Publication date Oct 5, 2023
- Intel Corporation
- Prabhat Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURE INCLUDING ACTIVE BASE SUBSTRATE WITH THRO...
- Publication number 20230299049
- Publication date Sep 21, 2023
- Intel Corporation
- Nitin A. Deshpande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HBI DIE ARCHITECTURE WITH FIDUCIAL IN STREET FOR NO METAL DEPOPULAT...
- Publication number 20230207479
- Publication date Jun 29, 2023
- Intel Corporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HBI DIE FIDUCIAL ARCHITECTURE WITH CANTILEVER FIDUCIALS FOR SMALLER...
- Publication number 20230207480
- Publication date Jun 29, 2023
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE STACKING WITH MIXED HYBRID AND SOLDER BONDING
- Publication number 20230207525
- Publication date Jun 29, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE IC DIE PACKAGE INCLUDING AN ELECTRO-THERMO-MECHANICAL DIE...
- Publication number 20230207471
- Publication date Jun 29, 2023
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MOLD-INTERCONNECT STRUCTURE ON AN IC DIE DIRECTLY BONDED TO...
- Publication number 20230207545
- Publication date Jun 29, 2023
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER-TO-WAFER HYBRID BONDING INTERCONNECT ARCHITECTU...
- Publication number 20230207522
- Publication date Jun 29, 2023
- Intel Corporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE-ALIGNED TEMPLATE STRUCTURE FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20230197546
- Publication date Jun 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE SEAL COATING OF HYBRID BONDED STACKED DIE PACKAGE ASSEMBLY
- Publication number 20230197637
- Publication date Jun 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY DIE PLACEMENT WITHIN A DICING STREET OF A WAFER
- Publication number 20230197520
- Publication date Jun 22, 2023
- Intel Corporation
- Yi SHI
- H01 - BASIC ELECTRIC ELEMENTS

Nitin A. Deshpande Jr.

Person

Patents Grantslast 30 patents

Microelectronic structures including bridges

Patch on interposer architecture for low cost optical co-packaging

Silicon groove architectures and manufacturing processes for passiv...

Open cavity bridge power delivery architectures and processes

Microelectronic structures including bridges

Microelectronic structures including bridges

Underfill material flow control for reduced die-to-die spacing in s...

Microelectronic structures including bridges

Multichip semiconductor package including a bridge die disposed in...

Low cost package warpage solution

Microelectronic structures including bridges

Electronic assembly that includes a bridge

Coupled cooling fins in ultra-small systems

Thermal management solutions for integrated circuit packages

Microelectronic structures including bridges

Antenna boards and communication devices

Microelectronic structures including bridges

Low cost package warpage solution

Mold material architecture for package device structures

Thermally coupled package-on-package semiconductor packages

Warpage control for microelectronics packages

Package on package thermal transfer systems and methods

Embedded multi-device bridge with through-bridge conductive via sig...

Low cost package warpage solution

Method and materials for warpage thermal and interconnect solutions

Electro-magnetic interference (EMI) shielding techniques and config...

Package on package thermal transfer systems and methods

Low cost package warpage solution

Warpage control for microelectronics packages

Embedded multi-device bridge with through-bridge conductive via sig...

Patents Applicationslast 30 patents

MEMORY STACKS INCLUDING REPLACEMENT BLOCKS AND RELATED METHODS

METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES

PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN

ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC IN...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF...

PACKAGE ARCHITECTURE OF SCALABLE COMPUTE WALL HAVING COMPUTE BRICK...

FIDUCIAL MARKS FOR VERIFYING ALIGNMENT ACCURACY OF BONDED INTEGRATE...

PACKAGE ARCHITECTURE WITH COMPUTE BRICKS HAVING VERTICALLY STACKED...

PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH IN...

PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIE...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT D...

PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT D...

PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLA...

INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNI...

LOW COST PACKAGE WARPAGE SOLUTION

PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD...

COVERED CAVITY FOR A PHOTONIC INTEGRATED CIRCUIT (PIC)

RIBBON SHIELD DEVICE AND METHOD

MICROELECTRONIC STRUCTURE INCLUDING ACTIVE BASE SUBSTRATE WITH THRO...

HBI DIE ARCHITECTURE WITH FIDUCIAL IN STREET FOR NO METAL DEPOPULAT...

HBI DIE FIDUCIAL ARCHITECTURE WITH CANTILEVER FIDUCIALS FOR SMALLER...

IC DIE STACKING WITH MIXED HYBRID AND SOLDER BONDING

COMPOSITE IC DIE PACKAGE INCLUDING AN ELECTRO-THERMO-MECHANICAL DIE...

THROUGH-MOLD-INTERCONNECT STRUCTURE ON AN IC DIE DIRECTLY BONDED TO...

RECONSTITUTED WAFER-TO-WAFER HYBRID BONDING INTERCONNECT ARCHITECTU...

EDGE-ALIGNED TEMPLATE STRUCTURE FOR INTEGRATED CIRCUIT PACKAGES

MOISTURE SEAL COATING OF HYBRID BONDED STACKED DIE PACKAGE ASSEMBLY

DUMMY DIE PLACEMENT WITHIN A DICING STREET OF A WAFER