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Nitin A. Deshpande Jr.
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Microelectronic structures including bridges
Patent number
11,923,307
Issue date
Mar 5, 2024
Intel Corporation
Bai Nie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic structures including bridges
Patent number
11,887,962
Issue date
Jan 30, 2024
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Underfill material flow control for reduced die-to-die spacing in s...
Patent number
11,854,945
Issue date
Dec 26, 2023
Tahoe Research, LTD.
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic structures including bridges
Patent number
11,804,441
Issue date
Oct 31, 2023
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multichip semiconductor package including a bridge die disposed in...
Patent number
11,791,274
Issue date
Oct 17, 2023
Intel Corporation
Manish Dubey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low cost package warpage solution
Patent number
11,764,080
Issue date
Sep 19, 2023
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic structures including bridges
Patent number
11,735,558
Issue date
Aug 22, 2023
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic assembly that includes a bridge
Patent number
11,676,900
Issue date
Jun 13, 2023
Intel Corporation
Eric J. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coupled cooling fins in ultra-small systems
Patent number
11,574,851
Issue date
Feb 7, 2023
Intel Corporation
Aastha Uppal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management solutions for integrated circuit packages
Patent number
11,545,407
Issue date
Jan 3, 2023
Intel Corporation
Kumar Abhishek Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic structures including bridges
Patent number
11,521,931
Issue date
Dec 6, 2022
Intel Corporation
Jason M. Gamba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna boards and communication devices
Patent number
11,522,291
Issue date
Dec 6, 2022
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic structures including bridges
Patent number
11,373,972
Issue date
Jun 28, 2022
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low cost package warpage solution
Patent number
11,328,937
Issue date
May 10, 2022
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mold material architecture for package device structures
Patent number
11,254,563
Issue date
Feb 22, 2022
Intel Corporation
Omkar G. Karhade
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Thermally coupled package-on-package semiconductor packages
Patent number
11,222,877
Issue date
Jan 11, 2022
Intel Corporation
Omkar Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Warpage control for microelectronics packages
Patent number
11,114,388
Issue date
Sep 7, 2021
Intel Corporation
Eric J. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package on package thermal transfer systems and methods
Patent number
11,056,466
Issue date
Jul 6, 2021
Intel Corporation
Omkar Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded multi-device bridge with through-bridge conductive via sig...
Patent number
10,797,000
Issue date
Oct 6, 2020
Intel Corporation
Nitin A. Deshpande
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low cost package warpage solution
Patent number
10,741,419
Issue date
Aug 11, 2020
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and materials for warpage thermal and interconnect solutions
Patent number
10,672,626
Issue date
Jun 2, 2020
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electro-magnetic interference (EMI) shielding techniques and config...
Patent number
10,595,409
Issue date
Mar 17, 2020
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package on package thermal transfer systems and methods
Patent number
10,438,930
Issue date
Oct 8, 2019
Intel Corporation
Omkar Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low cost package warpage solution
Patent number
10,403,512
Issue date
Sep 3, 2019
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Warpage control for microelectronics packages
Patent number
10,256,198
Issue date
Apr 9, 2019
Intel Corporation
Eric J. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded multi-device bridge with through-bridge conductive via sig...
Patent number
10,229,882
Issue date
Mar 12, 2019
Intel Corporation
Nitin A. Deshpande
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Underfill material flow control for reduced die-to-die spacing in s...
Patent number
10,192,810
Issue date
Jan 29, 2019
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with embedded bridge
Patent number
10,068,852
Issue date
Sep 4, 2018
Intel Corporation
Ravindranath V. Mahajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit assembly that includes stacked dice
Patent number
9,991,243
Issue date
Jun 5, 2018
Intel Corporation
Omkar Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic assembly that includes stacked electronic devices
Patent number
9,941,246
Issue date
Apr 10, 2018
Intel Corporation
Nitin Deshpande
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF...
Publication number
20240113088
Publication date
Apr 4, 2024
Intel Corporation
Omkar Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE OF SCALABLE COMPUTE WALL HAVING COMPUTE BRICK...
Publication number
20240006395
Publication date
Jan 4, 2024
Intel Corporation
Sagar Suthram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FIDUCIAL MARKS FOR VERIFYING ALIGNMENT ACCURACY OF BONDED INTEGRATE...
Publication number
20240006332
Publication date
Jan 4, 2024
Intel Corporation
Dimitrios Antartis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH COMPUTE BRICKS HAVING VERTICALLY STACKED...
Publication number
20240006375
Publication date
Jan 4, 2024
Sagar Suthram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH IN...
Publication number
20230420411
Publication date
Dec 28, 2023
Intel Corporation
Sagar Suthram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIE...
Publication number
20230420432
Publication date
Dec 28, 2023
Intel Corporation
Sagar Suthram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
Publication number
20230420376
Publication date
Dec 28, 2023
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT D...
Publication number
20230420436
Publication date
Dec 28, 2023
Intel Corporation
Sagar Suthram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT D...
Publication number
20230420409
Publication date
Dec 28, 2023
Intel Corporation
Sagar Suthram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLA...
Publication number
20230420410
Publication date
Dec 28, 2023
Intel Corporation
Sagar Suthram
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNI...
Publication number
20230387074
Publication date
Nov 30, 2023
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
Publication number
20230369071
Publication date
Nov 16, 2023
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD...
Publication number
20230343769
Publication date
Oct 26, 2023
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COVERED CAVITY FOR A PHOTONIC INTEGRATED CIRCUIT (PIC)
Publication number
20230341622
Publication date
Oct 26, 2023
Intel Corporation
Chia-Pin Chiu
G02 - OPTICS
Information
Patent Application
RIBBON SHIELD DEVICE AND METHOD
Publication number
20230317680
Publication date
Oct 5, 2023
Intel Corporation
Prabhat Ranjan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC STRUCTURE INCLUDING ACTIVE BASE SUBSTRATE WITH THRO...
Publication number
20230299049
Publication date
Sep 21, 2023
Intel Corporation
Nitin A. Deshpande
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HBI DIE ARCHITECTURE WITH FIDUCIAL IN STREET FOR NO METAL DEPOPULAT...
Publication number
20230207479
Publication date
Jun 29, 2023
Intel Corporation
Omkar KARHADE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HBI DIE FIDUCIAL ARCHITECTURE WITH CANTILEVER FIDUCIALS FOR SMALLER...
Publication number
20230207480
Publication date
Jun 29, 2023
Omkar KARHADE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC DIE STACKING WITH MIXED HYBRID AND SOLDER BONDING
Publication number
20230207525
Publication date
Jun 29, 2023
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE IC DIE PACKAGE INCLUDING AN ELECTRO-THERMO-MECHANICAL DIE...
Publication number
20230207471
Publication date
Jun 29, 2023
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH-MOLD-INTERCONNECT STRUCTURE ON AN IC DIE DIRECTLY BONDED TO...
Publication number
20230207545
Publication date
Jun 29, 2023
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED WAFER-TO-WAFER HYBRID BONDING INTERCONNECT ARCHITECTU...
Publication number
20230207522
Publication date
Jun 29, 2023
Intel Corporation
Omkar KARHADE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EDGE-ALIGNED TEMPLATE STRUCTURE FOR INTEGRATED CIRCUIT PACKAGES
Publication number
20230197546
Publication date
Jun 22, 2023
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOISTURE SEAL COATING OF HYBRID BONDED STACKED DIE PACKAGE ASSEMBLY
Publication number
20230197637
Publication date
Jun 22, 2023
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUMMY DIE PLACEMENT WITHIN A DICING STREET OF A WAFER
Publication number
20230197520
Publication date
Jun 22, 2023
Intel Corporation
Yi SHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EDGE-ALIGNED TEMPLATE STRUCTURE FOR INTEGRATED CIRCUIT PACKAGES
Publication number
20230197547
Publication date
Jun 22, 2023
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FORMATION OF A RECONSTITUTED CIRCUIT DEVICE USING FLOW OF A MATERIA...
Publication number
20230197551
Publication date
Jun 22, 2023
Intel Corporation
OMKAR KARHADE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
Publication number
20230088009
Publication date
Mar 23, 2023
Intel Corporation
Omkar G. Karhade
G02 - OPTICS
Information
Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
Publication number
20230087809
Publication date
Mar 23, 2023
Intel Corporation
Xiaoqian Li
G02 - OPTICS
Information
Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
Publication number
20230089494
Publication date
Mar 23, 2023
Intel Corporation
Xiaoqian Li
G02 - OPTICS