Nitin Juneja

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged integrated device with memory buffer integrated circuit di...
- Patent number 12,087,681
- Issue date Sep 10, 2024
- RAMBUS INC.
- Shahram Nikoukary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated device having memory buffer integrated circuit...
- Patent number 11,742,277
- Issue date Aug 29, 2023
- RAMBUS INC.
- Shahram Nikoukary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die package with aligned active and passive through-silicon...
- Patent number 10,026,666
- Issue date Jul 17, 2018
- Rambus Inc.
- Nitin Juneja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout of Vdd and Vss balls in a four layer PBGA
- Patent number 6,452,262
- Issue date Sep 17, 2002
- LSI Logic Corporation
- Nitin Juneja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for increasing trace rows of a ball grid array
- Patent number 6,406,936
- Issue date Jun 18, 2002
- LSI Logic Corporation
- Nitin Juneja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single reference plane plastic ball grid array package
- Patent number 6,396,140
- Issue date May 28, 2002
- LSI Logic Corporation
- Nitin Juneja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic ball grid array package with strip line configuration
- Patent number 6,225,690
- Issue date May 1, 2001
- LSI Logic Corporation
- Nitin Juneja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single reference plane plastic ball grid array package
- Patent number 6,127,728
- Issue date Oct 3, 2000
- LSI Logic Corporation
- Nitin Juneja
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES
- Publication number 20240038672
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Mahalingam NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED DEVICE
- Publication number 20230420356
- Publication date Dec 28, 2023
- Rambus Inc.
- Shahram NIKOUKARY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED DEVICE
- Publication number 20210305142
- Publication date Sep 30, 2021
- Rambus Inc.
- Shahram NIKOUKARY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE
- Publication number 20150108656
- Publication date Apr 23, 2015
- RAMBUS INC.
- Nitin Juneja
- H01 - BASIC ELECTRIC ELEMENTS

Nitin Juneja

Person

Patents Grantslast 30 patents

Packaged integrated device with memory buffer integrated circuit di...

Packaged integrated device having memory buffer integrated circuit...

Stacked die package with aligned active and passive through-silicon...

Layout of Vdd and Vss balls in a four layer PBGA

Method for increasing trace rows of a ball grid array

Single reference plane plastic ball grid array package

Plastic ball grid array package with strip line configuration

Single reference plane plastic ball grid array package

Patents Applicationslast 30 patents

PACKAGE COMPRISING INTEGRATED DEVICES

PACKAGED INTEGRATED DEVICE

PACKAGED INTEGRATED DEVICE

STACKED DIE PACKAGE