No Sun Park

Person

Gwangju-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 11,961,867
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,842,970
- Issue date Dec 12, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 11,362,128
- Issue date Jun 14, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,121,102
- Issue date Sep 14, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 10,692,918
- Issue date Jun 23, 2020
- Amkor Technology, Inc.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,535,620
- Issue date Jan 14, 2020
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 10,304,890
- Issue date May 28, 2019
- Amkor Technology, Inc.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,115,705
- Issue date Oct 30, 2018
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,929,113
- Issue date Mar 27, 2018
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 9,831,282
- Issue date Nov 28, 2017
- Amkor Technology, Inc.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method therefor
- Patent number 9,543,235
- Issue date Jan 10, 2017
- Amkor Technology, Inc.
- Hyung Il Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,466,580
- Issue date Oct 11, 2016
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package of finger print sensor and fabricating method thereof
- Patent number 9,431,447
- Issue date Aug 30, 2016
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,406,639
- Issue date Aug 2, 2016
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved redistribution layer design and...
- Patent number 9,293,403
- Issue date Mar 22, 2016
- Amkor Technology, Inc.
- No Sun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method therefor
- Patent number 9,184,148
- Issue date Nov 10, 2015
- Amkor Technology, Inc.
- Hyung Il Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package of finger print sensor and fabricating method thereof
- Patent number 9,129,873
- Issue date Sep 8, 2015
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating structure for wafer level packages
- Patent number 9,070,675
- Issue date Jun 30, 2015
- Amkor Technology, Inc.
- Kwang Sup So
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20240347575
- Publication date Oct 17, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258253
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220148987
- Publication date May 12, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20210020679
- Publication date Jan 21, 2021
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200328170
- Publication date Oct 15, 2020
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20190393258
- Publication date Dec 26, 2019
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180240768
- Publication date Aug 23, 2018
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20180083061
- Publication date Mar 22, 2018
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170062364
- Publication date Mar 2, 2017
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20160365379
- Publication date Dec 15, 2016
- Amkor Technology, Inc.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Package and Manufacturing Method Thereof
- Publication number 20160322334
- Publication date Nov 3, 2016
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160163662
- Publication date Jun 9, 2016
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
- Publication number 20160118319
- Publication date Apr 28, 2016
- Amkor Technology, Inc.
- Hyung Il Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE OF FINGER PRINT SENSOR AND FABRICATING METHOD THEREOF
- Publication number 20150340399
- Publication date Nov 26, 2015
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
- Publication number 20150115422
- Publication date Apr 30, 2015
- Amkor Technology, Inc.
- Hyung Il Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE OF FINGER PRINT SENSOR AND FABRICATING METHOD THEREOF
- Publication number 20140138788
- Publication date May 22, 2014
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plating Structure For Wafer Level Packages
- Publication number 20140070408
- Publication date Mar 13, 2014
- Kwang Sup So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED REDISTRIBUTION LAYER DESIGN AND...
- Publication number 20140061900
- Publication date Mar 6, 2014
- No Sun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Manufacturing Method Thereof
- Publication number 20140042600
- Publication date Feb 13, 2014
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS

No Sun Park

Person

Patents Grantslast 30 patents

Electronic device package and fabricating method thereof

Semiconductor package and manufacturing method thereof

Electronic device package and fabricating method thereof

Semiconductor package and manufacturing method thereof

Electronic device package and fabricating method thereof

Semiconductor package and manufacturing method thereof

Electronic device package and fabricating method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Electronic device package and fabricating method thereof

Semiconductor package and method therefor

Semiconductor package and manufacturing method thereof

Package of finger print sensor and fabricating method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package with improved redistribution layer design and...

Semiconductor package and method therefor

Package of finger print sensor and fabricating method thereof

Plating structure for wafer level packages

Patents Applicationslast 30 patents

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

Semiconductor Package and Manufacturing Method Thereof

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD THEREFOR

PACKAGE OF FINGER PRINT SENSOR AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD THEREFOR

PACKAGE OF FINGER PRINT SENSOR AND FABRICATING METHOD THEREOF

Plating Structure For Wafer Level Packages

SEMICONDUCTOR PACKAGE WITH IMPROVED REDISTRIBUTION LAYER DESIGN AND...

Semiconductor Package and Manufacturing Method Thereof