Noboru Hayasaka

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Image pickup apparatus and method of manufacturing the same
- Patent number 8,009,222
- Issue date Aug 30, 2011
- Fujitsu Semiconductor Limited
- Naoyuki Watanabe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of resin sealing electronic part
- Patent number 7,923,303
- Issue date Apr 12, 2011
- Fujitsu Semiconductor Limited
- Yoshito Akutagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of resin sealing electronic part
- Patent number 7,638,367
- Issue date Dec 29, 2009
- Fujitsu Microelectronics Limited
- Yoshito Akutagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum fixing jig for semiconductor device
- Patent number 7,571,538
- Issue date Aug 11, 2009
- Fujitsu Microelectronics Limited
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Grant
Jig for a semiconductor substrate
- Patent number 7,395,847
- Issue date Jul 8, 2008
- Fujitsu Limited
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate sheet material for a semiconductor device and a manufactu...
- Patent number 7,157,311
- Issue date Jan 2, 2007
- Fujitsu Limited
- Kouichi Meguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a method for fix...
- Patent number 7,109,561
- Issue date Sep 19, 2006
- Fujitsu Limited
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Grant
Method of resin encapsulation, apparatus for resin encapsulation, m...
- Patent number 7,056,770
- Issue date Jun 6, 2006
- Towa Corporation
- Hiroshi Uragami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor device that has improved structural...
- Patent number 6,951,800
- Issue date Oct 4, 2005
- Fujitsu Limited
- Yoshiaki Shinjo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device and a method for fix...
- Patent number 6,902,944
- Issue date Jun 7, 2005
- Fujitsu Limited
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing a semiconductor device and a method for fix...
- Patent number 6,750,074
- Issue date Jun 15, 2004
- Fujitsu Limited
- Kazuo Teshirogi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF RESIN SEALING ELECTRONIC PART
- Publication number 20100052212
- Publication date Mar 4, 2010
- FUJITSU MICROELECTRONICS LIMITED
- Yoshito AKUTAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of resin sealing electronic part
- Publication number 20070196957
- Publication date Aug 23, 2007
- FUJITSU LIMITED
- Yoshito Akutagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image pickup apparatus and method of manufacturing the same
- Publication number 20070091198
- Publication date Apr 26, 2007
- FUJITSU LIMITED
- Naoyuki Watanabe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Substrate sheet material for a semiconductor device and a manufactu...
- Publication number 20070065653
- Publication date Mar 22, 2007
- FUJITSU LIMITED
- Kouichi Meguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device and a method for fix...
- Publication number 20050221587
- Publication date Oct 6, 2005
- FUJITSU LIMITED
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Application
Method of manufacturing a semiconductor device and a method for fix...
- Publication number 20050221589
- Publication date Oct 6, 2005
- FUJITSU LIMITED
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Application
Method of manufacturing a semiconductor device and a method for fix...
- Publication number 20050221588
- Publication date Oct 6, 2005
- FUJITSU LIMITED
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Application
Method of Manufacturing a Semiconductor Device and a Method for Fix...
- Publication number 20040161882
- Publication date Aug 19, 2004
- FUJITSU LIMITED
- Kazuo Teshirogi
- B24 - GRINDING POLISHING
Information Patent Application
Method of resin encapsulation, apparatus for resin encapsulation, m...
- Publication number 20040101631
- Publication date May 27, 2004
- TOWA CORPORATION
- Hiroshi Uragami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate sheet material for a semiconductor device and a manufactu...
- Publication number 20040099943
- Publication date May 27, 2004
- FUJITSU LIMITED
- Kouichi Meguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making semiconductor device that has improved structural...
- Publication number 20030077880
- Publication date Apr 24, 2003
- FUJITSU LIMITED
- Yoshiaki Shinjo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor substrate jig and method of manufacturing a semicondu...
- Publication number 20030077854
- Publication date Apr 24, 2003
- FUJITSU LIMITED
- Kazuo Teshirogi
- B24 - GRINDING POLISHING

Noboru Hayasaka

Person

Patents Grantslast 30 patents

Image pickup apparatus and method of manufacturing the same

Method of resin sealing electronic part

Method of resin sealing electronic part

Vacuum fixing jig for semiconductor device

Jig for a semiconductor substrate

Substrate sheet material for a semiconductor device and a manufactu...

Method of manufacturing a semiconductor device and a method for fix...

Method of resin encapsulation, apparatus for resin encapsulation, m...

Method of making semiconductor device that has improved structural...

Method of manufacturing a semiconductor device and a method for fix...

Method of manufacturing a semiconductor device and a method for fix...

Patents Applicationslast 30 patents

METHOD OF RESIN SEALING ELECTRONIC PART

Method of resin sealing electronic part

Image pickup apparatus and method of manufacturing the same

Substrate sheet material for a semiconductor device and a manufactu...

Method of manufacturing a semiconductor device and a method for fix...

Method of manufacturing a semiconductor device and a method for fix...

Method of manufacturing a semiconductor device and a method for fix...

Method of Manufacturing a Semiconductor Device and a Method for Fix...

Method of resin encapsulation, apparatus for resin encapsulation, m...

Substrate sheet material for a semiconductor device and a manufactu...

Method of making semiconductor device that has improved structural...

Semiconductor substrate jig and method of manufacturing a semicondu...