Noboru Morimoto

Person

Chiyoda-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having termination region with insulator films...
- Patent number 10,892,363
- Issue date Jan 12, 2021
- Mitsubishi Electric Corporation
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having termination region with insulator havin...
- Patent number 10,686,068
- Issue date Jun 16, 2020
- Mitsubishi Electric Corporation
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture thereof
- Patent number 8,169,080
- Issue date May 1, 2012
- Renesas Electronics Corporation
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and manufacturing method thereof
- Patent number 8,008,730
- Issue date Aug 30, 2011
- Renesas Electronics Corporation
- Shoichi Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture thereof
- Patent number 7,884,011
- Issue date Feb 8, 2011
- Renesas Electronics Corporation
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture thereof
- Patent number 7,714,413
- Issue date May 11, 2010
- Renesas Technology Corp.
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing structure for connecting interconnect lines...
- Patent number 6,780,769
- Issue date Aug 24, 2004
- Renesas Technology Corp.
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 6,737,319
- Issue date May 18, 2004
- Renesas Technology Corp.
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element and MIM-type capacitor formed in different la...
- Patent number 6,734,489
- Issue date May 11, 2004
- Renesas Technology Corp.
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure for an integrated circuit
- Patent number 6,664,641
- Issue date Dec 16, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Akihiko Ohsaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for connecting interconnect lines with interposed layer i...
- Patent number 6,624,516
- Issue date Sep 23, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 6,509,648
- Issue date Jan 21, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing contact structure
- Patent number 6,399,424
- Issue date Jun 4, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Masazumi Matsuura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200243680
- Publication date Jul 30, 2020
- Mitsubishi Electric Corporation
- Noboru MORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190305140
- Publication date Oct 3, 2019
- Mitsubishi Electric Corporation
- Noboru MORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20110101530
- Publication date May 5, 2011
- Renesas Technology Corp.
- Noboru MORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20100167525
- Publication date Jul 1, 2010
- Renesas Technology Corp.
- Noboru MORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
- Publication number 20100052062
- Publication date Mar 4, 2010
- RENESAS TECHNOLOGY CORP.
- Shoichi Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20070090447
- Publication date Apr 26, 2007
- Renesas Technology Corp.
- Noboru MORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device including sealing ring
- Publication number 20060103025
- Publication date May 18, 2006
- Renesas Technology Corp.
- Takeshi Furusawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for connecting interconnect lines and method of manufactu...
- Publication number 20030205825
- Publication date Nov 6, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring structure for an integrated circuit
- Publication number 20030189224
- Publication date Oct 9, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Akihiko Ohsaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device and semiconductor device
- Publication number 20030068880
- Publication date Apr 10, 2003
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device comprising MIM-type capacitor and method of ma...
- Publication number 20020179955
- Publication date Dec 5, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Noboru Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR CONNECTING INTERCONNECT LINES WITH INTERPOSED LAYER I...
- Publication number 20020171149
- Publication date Nov 21, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS

Noboru Morimoto

Person

Patents Grantslast 30 patents

Semiconductor device having termination region with insulator films...

Semiconductor device having termination region with insulator havin...

Semiconductor device and method of manufacture thereof

Semiconductor device, and manufacturing method thereof

Semiconductor device and method of manufacture thereof

Semiconductor device and method of manufacture thereof

Method of manufacturing structure for connecting interconnect lines...

Method of manufacturing semiconductor device and semiconductor device

Semiconductor element and MIM-type capacitor formed in different la...

Wiring structure for an integrated circuit

Structure for connecting interconnect lines with interposed layer i...

Method of manufacturing semiconductor device and semiconductor device

Method of manufacturing contact structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF

Semiconductor device including sealing ring

Structure for connecting interconnect lines and method of manufactu...

Wiring structure for an integrated circuit

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device comprising MIM-type capacitor and method of ma...

STRUCTURE FOR CONNECTING INTERCONNECT LINES WITH INTERPOSED LAYER I...