Noboru Okane

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Yokkaichi-Shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 8,231,046
- Issue date Jul 31, 2012
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,569,921
- Issue date Aug 4, 2009
- Kabushiki Kaisha Toshiba
- Noboru Okane
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20100181367
- Publication date Jul 22, 2010
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20080099532
- Publication date May 1, 2008
- Kabushiki Kaisha Toshiba
- Mitsuhiro Nakao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and manufacturing method thereof
- Publication number 20070023875
- Publication date Feb 1, 2007
- KABUSHIKI KAISHA TOSHIBA
- Noboru Okane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20070023922
- Publication date Feb 1, 2007
- KABUSHIKI KAISHA TOSHIBA
- Noboru Okane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060232288
- Publication date Oct 19, 2006
- KABUSHIKI KAISHA TOSHIBA
- Noboru Okane
- H01 - BASIC ELECTRIC ELEMENTS