Noboru Sakuma

Person

  • Tokyo, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer processing tape

    • Patent number 9,324,593
    • Issue date Apr 26, 2016
    • Furukawa Electric Co., Ltd.
    • Hiromitsu Maruyama
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Wafer processing tape

    • Patent number 9,324,592
    • Issue date Apr 26, 2016
    • Furukawa Electric Co., Ltd.
    • Hiromitsu Maruyama
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER PROCESSING TAPE

    • Publication number 20120100325
    • Publication date Apr 26, 2012
    • Hiromitsu MARUYAMA
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    WAFER PROCESSING TAPE

    • Publication number 20100227165
    • Publication date Sep 9, 2010
    • Hiromitsu Maruyama
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...