Noboru Takeda

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer forming method
- Patent number 12,194,571
- Issue date Jan 14, 2025
- Disco Corporation
- Taizo Kanezaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of plate-shaped object
- Patent number 12,134,577
- Issue date Nov 5, 2024
- Disco Corporation
- Fumiya Kawano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing apparatus
- Patent number 11,597,040
- Issue date Mar 7, 2023
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 10,923,398
- Issue date Feb 16, 2021
- Disco Corporation
- Noboru Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crystal orientation detecting apparatus and crystal orientation det...
- Patent number 10,809,201
- Issue date Oct 20, 2020
- Disco Corporation
- Noboru Takeda
- G01 - MEASURING TESTING
Information Patent Grant
Laser processing method and laser processing apparatus
- Patent number 10,780,524
- Issue date Sep 22, 2020
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inspecting apparatus and laser processing apparatus
- Patent number 10,628,933
- Issue date Apr 21, 2020
- Disco Corporation
- Noboru Takeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing method for wafer
- Patent number 10,553,490
- Issue date Feb 4, 2020
- Disco Corporation
- Hiroshi Morikazu
- G01 - MEASURING TESTING
Information Patent Grant
Method of processing single-crystal substrate
- Patent number 10,157,793
- Issue date Dec 18, 2018
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Internal crack detecting method and internal crack detecting apparatus
- Patent number 10,119,921
- Issue date Nov 6, 2018
- Disco Corporation
- Noboru Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of single-crystal substrate
- Patent number 10,103,061
- Issue date Oct 16, 2018
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing apparatus
- Patent number 10,071,442
- Issue date Sep 11, 2018
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 9,887,140
- Issue date Feb 6, 2018
- Disco Corporation
- Noboru Takeda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wafer processing method
- Patent number 9,812,362
- Issue date Nov 7, 2017
- Disco Corporation
- Noboru Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lift-off method
- Patent number 9,793,166
- Issue date Oct 17, 2017
- Disco Corporation
- Tasuku Koyanagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing method of optical device wafer
- Patent number 9,761,492
- Issue date Sep 12, 2017
- Disco Corporation
- Takumi Shotokuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing single-crystal substrate
- Patent number 9,735,040
- Issue date Aug 15, 2017
- Disco Corporation
- Hiroshi Morikazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip manufacturing method
- Patent number 9,682,440
- Issue date Jun 20, 2017
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical device wafer processing method
- Patent number 9,537,046
- Issue date Jan 3, 2017
- Disco Corporation
- Noboru Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plate-shaped object processing method
- Patent number 9,517,962
- Issue date Dec 13, 2016
- Disco Corporation
- Noboru Takeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method including a filament forming step and an et...
- Patent number 9,349,646
- Issue date May 24, 2016
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 9,305,793
- Issue date Apr 5, 2016
- Disco Corporation
- Hiroshi Morikazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing method
- Patent number 9,209,591
- Issue date Dec 8, 2015
- Disco Corporation
- Noboru Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing method
- Patent number 9,117,895
- Issue date Aug 25, 2015
- Disco Corporation
- Hiroshi Morikazu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of detecting condensing spot position in laser beam processi...
- Patent number 8,957,347
- Issue date Feb 17, 2015
- Disco Corporation
- Toshiyuki Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device processing method
- Patent number 8,258,045
- Issue date Sep 4, 2012
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing method for semiconductor wafer
- Patent number 8,252,667
- Issue date Aug 28, 2012
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser beam processing machine
- Patent number 7,642,485
- Issue date Jan 5, 2010
- Disco Corporation
- Noboru Takeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer laser processing method
- Patent number 7,582,541
- Issue date Sep 1, 2009
- Disco Corporation
- Noboru Takeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer holding mechanism
- Patent number 7,557,904
- Issue date Jul 7, 2009
- Disco Corporation
- Naoki Ohmiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FIXING PROTECTIVE MEMBER
- Publication number 20250140622
- Publication date May 1, 2025
- Disco Corporation
- Noboru TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEVERING MACHINE
- Publication number 20220241900
- Publication date Aug 4, 2022
- Disco Corporation
- Taizo KANEZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PLATE-SHAPED OBJECT
- Publication number 20220064049
- Publication date Mar 3, 2022
- Disco Corporation
- Fumiya KAWANO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GRINDING APPARATUS
- Publication number 20210347009
- Publication date Nov 11, 2021
- Disco Corporation
- Suguru HIRAIWA
- B24 - GRINDING POLISHING
Information Patent Application
WAFER FORMING METHOD
- Publication number 20210245304
- Publication date Aug 12, 2021
- Disco Corporation
- Taizo KANEZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20200006144
- Publication date Jan 2, 2020
- Disco Corporation
- Noboru TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYSTAL ORIENTATION DETECTING APPARATUS AND CRYSTAL ORIENTATION DET...
- Publication number 20190391083
- Publication date Dec 26, 2019
- Disco Corporation
- Noboru TAKEDA
- G02 - OPTICS
Information Patent Application
METHOD OF PROCESSING WORKPIECE WITH LASER BEAM
- Publication number 20190217419
- Publication date Jul 18, 2019
- Disco Corporation
- Naotoshi KIRIHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20180257171
- Publication date Sep 13, 2018
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
- Publication number 20180257174
- Publication date Sep 13, 2018
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD FOR WAFER
- Publication number 20180240708
- Publication date Aug 23, 2018
- Disco Corporation
- Hiroshi Morikazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERNAL CRACK DETECTING METHOD AND INTERNAL CRACK DETECTING APPARATUS
- Publication number 20170370856
- Publication date Dec 28, 2017
- Disco Corporation
- Noboru Takeda
- G01 - MEASURING TESTING
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20170301592
- Publication date Oct 19, 2017
- Disco Corporation
- Noboru Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20170256454
- Publication date Sep 7, 2017
- Disco Corporation
- Noboru Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTING APPARATUS AND LASER PROCESSING APPARATUS
- Publication number 20170243341
- Publication date Aug 24, 2017
- Disco Corporation
- Noboru Takeda
- G01 - MEASURING TESTING
Information Patent Application
PROCESSING METHOD OF OPTICAL DEVICE WAFER
- Publication number 20170103921
- Publication date Apr 13, 2017
- Disco Corporation
- Takumi Shotokuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20170066078
- Publication date Mar 9, 2017
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING SINGLE-CRYSTAL SUBSTRATE
- Publication number 20160270151
- Publication date Sep 15, 2016
- Disco Corporation
- Hiroshi Morikazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SINGLE-CRYSTAL SUBSTRATE
- Publication number 20160268155
- Publication date Sep 15, 2016
- Disco Corporation
- Hiroshi Morikazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF SINGLE-CRYSTAL SUBSTRATE
- Publication number 20160260630
- Publication date Sep 8, 2016
- Disco Corporation
- Hiroshi Morikazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20160172182
- Publication date Jun 16, 2016
- Disco Corporation
- Hiroshi Morikazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MANUFACTURING METHOD
- Publication number 20150343559
- Publication date Dec 3, 2015
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIFT-OFF METHOD
- Publication number 20150328872
- Publication date Nov 19, 2015
- Disco Corporation
- Tasuku Koyanagi
- B32 - LAYERED PRODUCTS
Information Patent Application
PLATE-SHAPED OBJECT PROCESSING METHOD
- Publication number 20150259235
- Publication date Sep 17, 2015
- Disco Corporation
- Noboru Takeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL DEVICE WAFER PROCESSING METHOD
- Publication number 20150044799
- Publication date Feb 12, 2015
- Disco Corporation
- Noboru Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING METHOD
- Publication number 20140334511
- Publication date Nov 13, 2014
- Disco Corporation
- Noboru Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20140256150
- Publication date Sep 11, 2014
- Disco Corporation
- Hiroshi Morikazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20140248757
- Publication date Sep 4, 2014
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD
- Publication number 20140213040
- Publication date Jul 31, 2014
- Disco Corporation
- Hiroshi Morikazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BEAM PROCESSING METHOD FOR WAFER
- Publication number 20130309844
- Publication date Nov 21, 2013
- Disco Corporation
- Noboru TAKEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Noboru Takeda

Person

Patents Grantslast 30 patents

Wafer forming method

Manufacturing method of plate-shaped object

Laser processing apparatus

Wafer processing method

Crystal orientation detecting apparatus and crystal orientation det...

Laser processing method and laser processing apparatus

Inspecting apparatus and laser processing apparatus

Processing method for wafer

Method of processing single-crystal substrate

Internal crack detecting method and internal crack detecting apparatus

Processing method of single-crystal substrate

Laser processing apparatus

Wafer processing method

Wafer processing method

Lift-off method

Processing method of optical device wafer

Method of processing single-crystal substrate

Chip manufacturing method

Optical device wafer processing method

Plate-shaped object processing method

Wafer processing method including a filament forming step and an et...

Wafer processing method

Laser processing method

Laser processing method

Method of detecting condensing spot position in laser beam processi...

Device processing method

Laser processing method for semiconductor wafer

Laser beam processing machine

Wafer laser processing method

Wafer holding mechanism

Patents Applicationslast 30 patents

METHOD OF FIXING PROTECTIVE MEMBER

SEVERING MACHINE

MANUFACTURING METHOD OF PLATE-SHAPED OBJECT

GRINDING APPARATUS

WAFER FORMING METHOD

WAFER PROCESSING METHOD

CRYSTAL ORIENTATION DETECTING APPARATUS AND CRYSTAL ORIENTATION DET...

METHOD OF PROCESSING WORKPIECE WITH LASER BEAM

LASER PROCESSING APPARATUS

LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS

PROCESSING METHOD FOR WAFER

INTERNAL CRACK DETECTING METHOD AND INTERNAL CRACK DETECTING APPARATUS

WAFER PROCESSING METHOD

WAFER PROCESSING METHOD

INSPECTING APPARATUS AND LASER PROCESSING APPARATUS

PROCESSING METHOD OF OPTICAL DEVICE WAFER

LASER PROCESSING APPARATUS

METHOD OF PROCESSING SINGLE-CRYSTAL SUBSTRATE

METHOD OF PROCESSING SINGLE-CRYSTAL SUBSTRATE

PROCESSING METHOD OF SINGLE-CRYSTAL SUBSTRATE

LASER PROCESSING APPARATUS

CHIP MANUFACTURING METHOD

LIFT-OFF METHOD

PLATE-SHAPED OBJECT PROCESSING METHOD

OPTICAL DEVICE WAFER PROCESSING METHOD

LASER PROCESSING METHOD

WAFER PROCESSING METHOD

WAFER PROCESSING METHOD

LASER PROCESSING METHOD

LASER BEAM PROCESSING METHOD FOR WAFER