Noboru Uehara

Person

Simosuwa-machi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive pattern formation ink, conductive pattern and wiring sub...
- Patent number 8,173,050
- Issue date May 8, 2012
- Seiko Epson Corporation
- Naoyuki Toyoda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive pattern forming ink, conductive pattern, and wiring subs...
- Patent number 8,017,043
- Issue date Sep 13, 2011
- Seiko Epson Corporation
- Naoyuki Toyoda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring structure between steps and wiring method thereof
- Patent number 8,012,870
- Issue date Sep 6, 2011
- Seiko Epson Corporation
- Noboru Uehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern forming system, pattern forming method, and electronic appa...
- Patent number 7,871,666
- Issue date Jan 18, 2011
- Seiko Epson Corporation
- Kazuaki Sakurada
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for forming wiring pattern, wiring pattern, and electronic a...
- Patent number 7,629,019
- Issue date Dec 8, 2009
- Seiko Epson Corporation
- Kazuaki Sakurada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring substrate and an electronic instru...
- Patent number 7,538,031
- Issue date May 26, 2009
- Seiko Epson Corporation
- Noboru Uehara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern forming system, pattern forming method, and electronic appa...
- Patent number 7,462,241
- Issue date Dec 9, 2008
- Seiko Epson Corporation
- Kazuaki Sakurada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring pattern formation method, wiring pattern, and electronic device
- Patent number 7,416,759
- Issue date Aug 26, 2008
- Seiko Epson Corporation
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring pattern formation method, manufacturing method for multi lay...
- Patent number 7,316,974
- Issue date Jan 8, 2008
- Seiko Epson Corporation
- Noboru Uehara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING CONDUCTOR PATTERN, WIRING BOARD, AND LIQUID DRO...
- Publication number 20110169884
- Publication date Jul 14, 2011
- SEIKO EPSON CORPORATION
- Naoyuki TOYODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERN FORMING SYSTEM, PATTERN FORMING METHOD, AND ELECTRONIC APPA...
- Publication number 20110097515
- Publication date Apr 28, 2011
- SEIKO EPSON CORPORATION
- Kazuaki Sakurada
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WIRING STRUCTURE BETWEEN STEPS AND WIRING METHOD THEREOF
- Publication number 20100127399
- Publication date May 27, 2010
- SEIKO EPSON CORPORATION
- Noboru UEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBS...
- Publication number 20090146113
- Publication date Jun 11, 2009
- SEIKO EPSON CORPORATION
- Naoyuki TOYODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PATTERN FORMATION INK, CONDUCTIVE PATTERN AND WIRING SUB...
- Publication number 20090145638
- Publication date Jun 11, 2009
- SEIKO EPSON CORPORATION
- Naoyuki Toyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pattern forming system, pattern forming method, and electronic appa...
- Publication number 20090035453
- Publication date Feb 5, 2009
- SEIKO EPSON CORPORATION
- Kazuaki Sakurada
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Wiring pattern formation method, manufacturing method for multi lay...
- Publication number 20060127567
- Publication date Jun 15, 2006
- Seiko Epson Corporation
- Noboru Uehara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Pattern forming system, pattern forming method, and electronic appa...
- Publication number 20060087545
- Publication date Apr 27, 2006
- SEIKO EPSON CORPORATION
- Kazuaki Sakurada
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method for forming wiring pattern, wiring pattern, and electronic a...
- Publication number 20060065955
- Publication date Mar 30, 2006
- SEIKO EPSON CORPORATION
- Kazuaki Sakurada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a wiring substrate and an electronic instru...
- Publication number 20060068525
- Publication date Mar 30, 2006
- Seiko Epson Corporation
- Noboru Uehara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring pattern formation method, wiring pattern, and electronic device
- Publication number 20060068616
- Publication date Mar 30, 2006
- SEIKO EPSON CORPORATION
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pattern formation method, pattern formation system, and electronic...
- Publication number 20050200684
- Publication date Sep 15, 2005
- SEIKO EPSON CORPORATION
- Kazuaki Sakurada
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Noboru Uehara

Person

Patents Grantslast 30 patents

Conductive pattern formation ink, conductive pattern and wiring sub...

Conductive pattern forming ink, conductive pattern, and wiring subs...

Wiring structure between steps and wiring method thereof

Pattern forming system, pattern forming method, and electronic appa...

Method for forming wiring pattern, wiring pattern, and electronic a...

Method of manufacturing a wiring substrate and an electronic instru...

Pattern forming system, pattern forming method, and electronic appa...

Wiring pattern formation method, wiring pattern, and electronic device

Wiring pattern formation method, manufacturing method for multi lay...

Patents Applicationslast 30 patents

METHOD FOR FORMING CONDUCTOR PATTERN, WIRING BOARD, AND LIQUID DRO...

PATTERN FORMING SYSTEM, PATTERN FORMING METHOD, AND ELECTRONIC APPA...

WIRING STRUCTURE BETWEEN STEPS AND WIRING METHOD THEREOF

CONDUCTIVE PATTERN FORMING INK, CONDUCTIVE PATTERN, AND WIRING SUBS...

CONDUCTIVE PATTERN FORMATION INK, CONDUCTIVE PATTERN AND WIRING SUB...

Pattern forming system, pattern forming method, and electronic appa...

Wiring pattern formation method, manufacturing method for multi lay...

Pattern forming system, pattern forming method, and electronic appa...

Method for forming wiring pattern, wiring pattern, and electronic a...

Method of manufacturing a wiring substrate and an electronic instru...

Wiring pattern formation method, wiring pattern, and electronic device

Pattern formation method, pattern formation system, and electronic...