Nobuaki Miyamoto

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,382,217
- Issue date Jul 5, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,375,624
- Issue date Jun 28, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,337,314
- Issue date May 17, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,337,315
- Issue date May 17, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Carrier-attached copper foil, laminate, method for producing printe...
- Patent number 10,356,898
- Issue date Jul 16, 2019
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Carrier-attached copper foil, laminate, laminate producing method,...
- Patent number 10,349,531
- Issue date Jul 9, 2019
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier-attached copper foil, laminate, method for producing printe...
- Patent number 10,299,385
- Issue date May 21, 2019
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Carrier-attached copper foil, laminate, method for producing printe...
- Patent number 10,251,283
- Issue date Apr 2, 2019
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil, copper foil with carrier, substrate, r...
- Patent number 9,955,583
- Issue date Apr 24, 2018
- JX Nippon Mining & Metals Corporation
- Masafumi Ishii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...
- Publication number 20210362475
- Publication date Nov 25, 2021
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...
- Publication number 20210360785
- Publication date Nov 18, 2021
- JX NIPPON MINING & METALS CORPORATION
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...
- Publication number 20210331449
- Publication date Oct 28, 2021
- JX NIPPON MINING & METALS CORPORATION
- Nobuaki Miyamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...
- Publication number 20210337664
- Publication date Oct 28, 2021
- JX NIPPON MINING & METALS CORPORATION
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...
- Publication number 20180279482
- Publication date Sep 27, 2018
- JX NIPPON MINING & METALS CORPORATION
- Masafumi ISHII
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Carrier-Attached Copper Foil, Laminate, Method For Producing Printe...
- Publication number 20170042025
- Publication date Feb 9, 2017
- JX NIPPON MINING & METALS CORPORATION
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier-Attached Copper Foil, Laminate, Method For Producing Printe...
- Publication number 20170042044
- Publication date Feb 9, 2017
- JX NIPPON MINING & METALS CORPORATION
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier-Attached Copper Foil, Laminate, Method For Producing Printe...
- Publication number 20170042036
- Publication date Feb 9, 2017
- JX NIPPON MINING & METALS CORPORATION
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier-Attached Copper Foil, Laminate, Laminate Producing Method,...
- Publication number 20170019991
- Publication date Jan 19, 2017
- JX NIPPON MINING & METALS CORPORATION
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...
- Publication number 20160183380
- Publication date Jun 23, 2016
- MASAFUMI ISHII
- B32 - LAYERED PRODUCTS

Nobuaki Miyamoto

Person

Patents Grantslast 30 patents

Surface treated copper foil, copper clad laminate, and printed circ...

Surface treated copper foil, copper clad laminate, and printed circ...

Surface treated copper foil, copper clad laminate, and printed circ...

Surface treated copper foil, copper clad laminate, and printed circ...

Carrier-attached copper foil, laminate, method for producing printe...

Carrier-attached copper foil, laminate, laminate producing method,...

Carrier-attached copper foil, laminate, method for producing printe...

Carrier-attached copper foil, laminate, method for producing printe...

Surface-treated copper foil, copper foil with carrier, substrate, r...

Patents Applicationslast 30 patents

Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...

Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...

Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...

Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...

Carrier-Attached Copper Foil, Laminate, Method For Producing Printe...

Carrier-Attached Copper Foil, Laminate, Method For Producing Printe...

Carrier-Attached Copper Foil, Laminate, Method For Producing Printe...

Carrier-Attached Copper Foil, Laminate, Laminate Producing Method,...

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...